Ardentec Corporation

Equities

3264

TW0003264008

Semiconductor Equipment & Testing

End-of-day quote Taipei Exchange Other stock markets 23:00:00 13/06/2024 BST			5-day change	1st Jan Change
74.7 ^TWD	-1.06%		-1.45%	+0.95%

05-31	Ardentec Corporation Announces Cash Dividend, Payable on July 25, 2024	CI
05-14	Ardentec Corporation Reports Earnings Results for the First Quarter Ended March 31, 2024	CI

Ardentec Corporation Announces Change of Juristic-Person Representative Director

August 02, 2019 at 08:33 am

Ardentec Corporation announced change of juristic-person representative director from Ding-Hua Hu, Chairman of Homey Consulting Corporation to Jing-Yun Li, Chairman of Homey Consulting Corporation, effective August 2, 2019.

Latest news about Ardentec Corporation

Ardentec Corporation Announces Cash Dividend, Payable on July 25, 2024	05-31	CI
Ardentec Corporation Reports Earnings Results for the First Quarter Ended March 31, 2024	05-14	CI
Ardentec Corporation Reports Earnings Results for the Full Year Ended December 31, 2023	04-01	CI
Ardentec Corporation Approves Cash Dividends for the Year 2023	02-29	CI
Ardentec Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	26/10/23	CI
Ardentec Corporation Announces Executive Changes	26/10/23	CI
Ardentec Corporation Announces the Passing of Liang-Po Chen, Representative Director	01/10/23	CI
Ardentec Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	26/07/23	CI
Ardentec Corporation Reports Earnings Results for the First Quarter Ended March 31, 2023	12/05/23	CI
Ardentec Corporation Reports Earnings Results for the Full Year Ended December 31, 2022	15/03/23	CI
Ardentec Corporation Reports Earnings Results for the Full Year Ended December 31, 2022	15/03/23	CI
Ardentec Corporation Approves Cash Dividends for the Year Ended December 31, 2022	23/02/23	CI
Ardentec Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	27/10/22	CI
Ardentec Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	27/07/22	CI
Ardentec Corporation Reports Earnings Results for the First Quarter Ended March 31, 2022	28/04/22	CI
Ardentec Corporation Reports Earnings Results for the Full Year Ended December 31, 2021	23/02/22	CI
Ardentec Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	28/10/21	CI
Ardentec Corporation Announces Purchase Order of Machinery Equipment	09/09/21	CI
Ardentec Nanjing Co., Ltd. announced that it expects to receive $30 million in funding from Ardentec Corporation	25/08/21	CI
Ardentec Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2021	29/07/21	CI
Ardentec Corporation Announces Appointment of Leslie Guh, Division Director, Financial Management Division	29/04/21	CI
Ardentec Corporation Reports Earnings Results for the First Quarter Ended March 31, 2021	28/04/21	CI
Ardentec Corporation Approves Dividend Distribution	25/02/21	CI
Ardentec Corporation Reports Earnings Results for the Full Year Ended December 31, 2020	24/02/21	CI
Ardentec Corporation Reports Earnings Results for the Third Quarter Ended September 30, 2020	28/10/20	CI

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Company Profile

Ardentec Corporation is a Taiwan-based company principally engaged in the provision of wafer testing and product testing services. The Company provides memory integrated circuits (IC) testing, digital signal IC and mixed signal IC testing, wafer burn-in testing, laser repairing and trimming, embedded IC testing, liquid crystal display (LCD) drive IC testing, analog IC testing, radio frequency (RF) IC testing, as well as wafer testing technology development and product analysis services. The Company mainly conducts its businesses in the United States, Taiwan, Singapore and Mainland China.

Sector

Semiconductor Equipment & Testing

Calendar

27/06/2024 - Détachement de for final dividend

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Sector Semiconductor Testing Equipment & Service

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Semiconductor Testing Equipment & Service