Advantest Corporation announced to feature its wide range of solutions for advanced IC testing and wafer metrology at SEMICON Korea on January 23-25 at COEX in Seoul, South Korea. Among the products that Advantest will feature in booth #C510 in Hall C are systems and enhancements that the company has recently announced. These include the newest upgrades to the MPT3000 platform, creating the industry's first fully integrated test solution for developing, debugging and mass producing PCle Gen 4 solid-state drives (SSD); the flexible T5851 memory tester for next-generation mobile protocol NAND including UFS3.x and PCIe Gen4 BGA; the T5503HS2 system, the only tester of its kind to evaluate the advanced features of next-generation, high-speed LPDDR5 and DDR5 memories; HiFix high-speed memory test solutions supporting advanced device testing at speeds over 16 Gbps; and measurement solutions for nanotechnology applications, including Advantest's E3650, E5610, and E3310 scanning electron microscopes (SEM) for photo masks and wafers as well as the F7000 e-beam lithography system for the 1X-nm technology node. The booth will include an automotive display to illustrate how Advantest's test solutions are used in improving the performance and reliability of on-board electronics, from sensors to communications. Other areas of the booth will showcase the T2000 platform for system-level testing; the V93000 Smart Scale system's FVI16 floating high power VI source that enables testing of advanced ICs for automotive, industrial and PMIC applications; the EVA100 measurement system with its new HVI (high-voltage VI source and measurement) module, extending the platform's range to include high-power ICs used in large-volume consumer applications; and probe cards designed for use in Advantest's testers.