BANK VONTOBEL/CALL/TAIWAN SEMICONDUCTOR MANUFACT. ADR/240/0.1/17.01.25

BANK VONTOBEL/CALL/TAIWAN SEMICONDUCTOR MANUFACT. ADR/240/0.1/17.01.25 Share Price

DE000VD10ML6

Market Closed - Boerse Frankfurt Warrants 19:03:16 07/06/2024 BST
0.31 ^EUR	+6.90%

Current month	+129.63%
1 month	+256.32%

Comparison chart between the derivative product and it's underlying value

End-of-day quotes

Chart TSMC (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY)

Chart BANK VONTOBEL/CALL/TAIWAN SEMICONDUCTOR MANUFACT. ADR/240/0.1/17.01.25

Latest news about TSMC (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY)

Thinking about trading options or stock in Microsoft, Apple, Taiwan Semiconductor, Johnson & Johnson, or Nike?	03-19	PR
Thinking about trading options or stock in Amazon.com, Super Micro Computer, Taiwan Semiconductor, Microsoft, or Intel?	03-15	PR
Thinking about trading options or stock in Apple, Pfizer, Taiwan Semiconductor, Microsoft, or Novo Nordisk?	03-12	PR
Thinking about trading options or stock in Tesla, Taiwan Semiconductor, Microsoft, Marathon Digital, or Gitlab?	03-05	PR

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Quotes 5-day view

Date	Price	Change
07/06/24	0.31	+6.90%
06/06/24	0.29	0.00%
05/06/24	0.29	+102.80%
04/06/24	0.143	-12.27%
03/06/24	0.163	+20.74%

Real-time Boerse Frankfurt Warrants

Last update June 07, 2024 at 07:03 pm

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Static data

Product type	Plain-Vanilla-Warrants
Buy / Sell	CALL
Underlying	TSMC (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY)
Issuer	Vontobel
WKN	VD10ML
ISIN	DE000VD10ML6
Date issued	12/03/2024
Strike	240 $
Maturity	17/01/2025 (223 Days)
Parity	10 : 1
Emission price	0.31 €
Emission volume	N/A
Settlement	cash
Currency	EUR

Technical Indicators

Highest since issue	0.39 €
Lowest since issue	0.046 €
Spread	0.01 €
Spread %	3.13%

Company Profile

Taiwan Semiconductor Manufacturing Co Ltd is a Taiwan-based company mainly engaged in the provision of integrated circuit manufacturing services. The integrated circuit manufacturing services include process technology, special process technology, design ecosystem support, mask technology, 3DFabricTM advanced packaging and silicon stacking technology services. The Company has completed the transfer and mass production of 5nm technology, and is engaged in the research and development of 3nm process technology and 2nm process technology. The product application range covers the entire electronic application industry, including personal computers and peripheral products, information application products, wired and wireless communication system products, servers and data centers.

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