To Announce the 2022 second quarter consolidated financial
report submitted to the Board of Directors
Date of events
2022/08/09
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/08/09
2.Date of approval by the audit committee:2022/08/09
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):
2022/01/01~2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):68,449,555
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):12,989,502
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):5,686,477
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):7,337,012
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):6,505,689
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):4,507,014
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):4.77
11.Total assets end of the period (thousand NTD):206,793,163
12.Total liabilities end of the period
(thousand NTD):88,241,754
13.Equity attributable to owners of parent end of the
period (thousand NTD):86,965,114
14.Any other matters that need to be specified:None
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Zhen Ding Technology Holding Ltd. published this content on 09 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 09 August 2022 09:25:07 UTC.
Zhen Ding Technology Holding Ltd provides solutions for the design, development, manufacturing, and sales of all types of printed circuit boards (PCB), including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), integrated circuit (IC) substrates, rigid-flex PCBs, chip-on-film (COF), and modules. FPC is used in smartphones, notebooks, smart wearable devices, and many other products. SLP is used for semiconductor packaging in manufacturing processes. COF are used in fingerprint-on-display modules, smart watch display modules, and high-resolution television and medical displays. Its applications include mobile phone, computer, wearable, augmented reality (AR) and virtual reality (VR), smart home, other consumer, data center, base station, networking, and automotive and industrial. It has five manufacturing campuses and over 20 sales offices in multiple locations.