The Change of Accounting Officer, Financial Officer
and Acting Spokesperson
Date of events
2022/08/09
To which item it meets
paragraph 8
Statement
1.Type of personnel changed (please enter: spokesperson, acting
spokesperson, important personnel (CEO, COO, CMO, CSO, etc.)
,financial officer, accounting officer, corporate governance officer,
chief information security officer, research and development officer,
chief internal auditor, or designated and non-designated representatives):
accounting officer, financial officer and acting spokesperson
2.Date of occurrence of the change:2022/08/09
3.Name, title, and resume of the previous position holder:
(1)Accounting officer:CHANG JIN-TEN, Manager
(2)Financial officer:WANG YUAN SHENG, Assistant Vice President
(3)Acting spokesperson:CHANG JIN-TEN, Manager
4.Name, title, and resume of the new position holder:
(1)Accounting officer:WANG YUAN SHENG, Assistant Vice President
(previously served as financial officer)
(2)Financial officer:LIN TING HAO, Assistant Manager (previously
served as assistant manager of overseas finance department)
(3)Acting spokesperson: LIN TING HAO, Assistant Manager (previously
served as assistant manager of overseas finance department)
5.Type of the change (please enter: "resignation", "position
adjustment", "dismissal", "retirement", "death" or "new
replacement"):Position adjustment
6.Reason for the change:Position adjustment
7.Effective date:2022/08/09
8.Any other matters that need to be specified:None
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Disclaimer
Zhen Ding Technology Holding Ltd. published this content on 09 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 09 August 2022 08:35:07 UTC.
Zhen Ding Technology Holding Ltd provides solutions for the design, development, manufacturing, and sales of all types of printed circuit boards (PCB), including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), integrated circuit (IC) substrates, rigid-flex PCBs, chip-on-film (COF), and modules. FPC is used in smartphones, notebooks, smart wearable devices, and many other products. SLP is used for semiconductor packaging in manufacturing processes. COF are used in fingerprint-on-display modules, smart watch display modules, and high-resolution television and medical displays. Its applications include mobile phone, computer, wearable, augmented reality (AR) and virtual reality (VR), smart home, other consumer, data center, base station, networking, and automotive and industrial. It has five manufacturing campuses and over 20 sales offices in multiple locations.
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