Waffer Technology Corporation announced a private placement to issue 5,800,000 common shares at an issue price of TWD 10 per share for the gross proceeds of TWD 58,000,000 on June 14, 2024. The transaction has been approved by shareholders and is expected to close from existing shareholders and employees from July 18, 2024 to August 19, 2024 and payment period for subscription by specific persons from August 20, 2024 to August 22, 2024.
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- Waffer Technology Corporation announced that it expects to receive TWD 58 million in funding