TTM Technologies, Inc. : TTM Technologies Inc. to present at 14th Annual Needham Growth Conference on January 12th, 2012
January 04, 2012 at 06:53 pm
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TTM Technologies Inc. to present at 14th Annual Needham
Growth Conference on January 12th, 2012
SANTA ANA, CA - January 3, 2012 -TTM
Technologies, Inc. (Nasdaq: TTMI), a leading manufacturer
of time-critical, technologically advanced printed circuit
boards, will participate in the 14th Annual Needham Growth
Conference on Thursday, January 12, 2012 at 8:00 a.m.
Eastern time. The conference is being held at the New York
Palace Hotel in New York City.
Kent Alder, President and CEO, and Steve Richards, CFO,
will discuss TTM's successful strategy and its ability
to capture market share in the printed circuit board
industry.
The presentation will be webcast on the company's
website, , and will remain accessible for one week
following the event.
TTM Technologies, Inc. is a major global printed circuit
board manufacturer, focusing on quick-turn and
technologically advanced PCBs and the backplane and
sub-system assembly business. TTM stands for
time-to-market, representing how the company's
time-critical, one-stop manufacturing services enable
customers to shorten the time required to develop new
products and bring them to market. Additional information
can be found at .
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TTM Technologies, Inc. is a global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCB). The Company's segments include PCB, and RF and Specialty Components (RF&S Components). The PCB segment consists of approximately 16 domestic system, sub-system, and PCB plants; four PCB fabrication plants in China; one in Malaysia, and one in Canada. The RF&S Components segment consists of one domestic RF component plant and one RF component plant in China. Each segment operates predominantly in the same industries with facilities that produce customized products for its customers and use similar means of product distribution. It offers a range of engineered systems, RF and microwave assemblies, high density interconnect (HDI) PCBs, rigid-flex PCBs, custom assemblies and system integration, integrated circuit (IC) substrates and others.