Integrated Report 2022
Year Ended December 31, 2022
Technology Deepens at
0.000000001 m
Value Creation Story
Initiatives to Address Material Issues for Enhancing Corporate Value
Data Section
-PURPOSE/PHILOSOPHY-
Purpose:
Contribute to a sustainable future through chemistry
Management
Principles
Create a frank, open-minded business culture, continue efforts to enhance technology, raise the level of quality of products, and contribute to society
Management
Vision
The e-Material Global CompanyTM contributes to a sustainable future through chemistry
CSR Policy
- Increases the sustainable corporate value as a whole group by improving employee engagement.
- Continues to provide high-value- added products that contribute to technological innovations in order to resolve social issues.
- Strives to grow together with society and remain as an attractive company that earns the trust of all stakeholders.
Integrated Report 2022 001
August 2023
Noriaki Taneichi
Representative Director,
President & Chief Executive Officer
Value Creation Story | Initiatives to Address Material Issues | Data Section |
for Enhancing Corporate Value | ||
-A Society We Aim For-
TOK pursues a sustainable future society filled with happiness and this starts from the pursuit of happiness for individuals in the workplace.
Semiconductors substantially contribute to the resolution of a variety of different social and environmental issues that face humans and to convenient, comfortable, safe and secure lives. TOK is a manufacturer with the largest global market share of photoresists-materials essential for the manufacture and upgrading of semiconductors.
In Japan and internationally, TOK achieved sustainable growth by practicing customer-oriented strategies and by providing value created through the use of world-leading microprocessing
and high purity processing technologies that the company has continuously sophisticated over more than 80 years since its foundation. Under the management vision, The e-Material Global CompanyTM contributing to a sustainable future through chemistry, TOK is striving to create value from the long-term viewpoint, aiming to contribute to 5G and IoT innovation by 2030, to become a 100-year company in 2040, and achieving carbon neutrality by 2050.
In these everyday activities, TOK places the largest focus on "happiness" as the keyword. The TOK Group practices its purpose-contributeto a sustainable future through chemistry-extracted from the management vision and invests in human capital under the concept of pursuit of happiness for individuals in the workplace. The Group hopes that these measures will have a ripple effect to improve happiness for external stakeholders and broadly throughout society.
Human resources who feel a high level of happiness usually provide high performance. Customers who use our products with high added value produced by such human resources will also achieve high performance, leading to an increased sense of happiness. When consumers can improve the quality of life by using excellent end products produced by TOK customers, happiness will be enhanced broadly throughout society. TOK will continue to pursue a society where people feel a high level of happiness that starts from the pursuit of happiness for individuals in the workplace.
The Integrated Report 2022 provides a multi-faceted view of value creation by TOK from the perspectives of social impact and linkage and interaction among capital sources. The report also states how TOK enhances its corporate value in a sustainable manner while adding the viewpoints of self-reformation and stakeholder engagement as both risks and opportunities continue to be maximized.
In authoring this report, TOK referred to the International Integrated Reporting Framework promoted by the IFRS Foundation and Guidance for Integrated Corporate Disclosure and Company- Investor Dialog for Collaborative Value Creation 2.0 issued by the Ministry of Economy, Trade and Industry. The company considered the feedback received in dialogs with shareholders, investors, and other stakeholders, as well as the opinions received regarding the Integrated Report 2021.
I would like to assure the readers that this report represents our best efforts to bring together a variety of information related to long-term value creation at TOK through the commitment of management executives and company-wide due processes in each division.
002 TOKYO OHKA KOGYO CO., LTD. | Integrated Report 2022 003 |
CORE COMPETENCE 1
-World-leading microprocessing technology |
and continuously contributing | Value creation area = 1 nanometer*1 |
0.000000001 m | |
Enhancing intellectual capital | |
to a sustainable future | |
*1 Approx. 1/100,000 of hair thickness |
TOK was established as an R&D-driven company in 1940. The company developed semiconductor photoresists for the first time in 1968, and the company has continuously promoted R&D and upgraded microprocessing technology while accumulating intellectual capital, thereby contributing to the advancement of semiconductor technology.
Value Creation Story
TOK photoresists
Initiatives to Address Material Issues | Data Section |
for Enhancing Corporate Value | |
Highlights 2022
Aggregate market value
¥255.1 billion*4
Semiconductors
At present, TOK continuously upgrades its world-leading microprocessing technology under the purpose-Contributeto a sustainable future through chemistry. In this way, the company contributes to higher performance, lower power consumption, cost reduction, and miniaturization of semiconductors so that TOK can satisfy social expectations with end products and contribute to the generation of a positive social impact.
Trends of line width of semiconductors*2 | 1990s | |||||||
1980s | Line width of | |||||||
1970s | semiconductors | |||||||
semiconductors | 600 nm- | |||||||
Line width of | ||||||||
Line width of | 1,500 nm- | 130 nm | ||||||
semiconductors | ||||||||
10,000 nm- | 600 nm | |||||||
1,500 nm | ||||||||
Always satisfying social expectations with microprocessing technology
1970s | Social | 1980s | Social | 1990s | Social |
expectations | expectations | expectations | |||
More efficient | More advanced | More advanced | |||
economic | information | communication | |||
activities | processing |
Examples of | Examples of | Examples of |
final products | final products | final products |
Calculators*3 | PC | Feature phones |
Outputs | Outputs | Outputs | |
First semiconductor positive | i-Line photoresists | KrF excimer laser photoresists | |
photoresist developed in Japan | |||
*2 | Includes estimates by TOK for the decades shown | ||
*3 | The photos of examples of final products on this page are conceptual images. | ||
*4 | Calculated based on the closing stock price at FY 2022/12 end and the number of shares issued (including treasury stock) |
004 TOKYO OHKA KOGYO CO., LTD.
2010s- | 2020s- | ||||
2000s | Semiconductor | ||||
Semiconductor | process nodes | ||||
process nodes | 5 nm | ||||
Semiconductor | 32 nm- | ||||
process nodes | |||||
130 nm- | 7 nm | ||||
32 nm | |||||
Accumulated intellectual capital
2000s | Social | 2010s | Social | 2020s | Social | |||||||||||||||||||||||||||||||||||
expectations | expectations | expectations | ||||||||||||||||||||||||||||||||||||||
Social | Promotion of | Advancement | ||||||||||||||||||||||||||||||||||||||
networking | of AI | |||||||||||||||||||||||||||||||||||||||
decarbonization |
Examples of | Examples of | Examples of | |
final products | final products | final products | |
Smartphones | General electronic | Interactive AI | |
products | |||
Outputs | Outputs | Outputs | |
ArF excimer laser photoresists | Full portfolio | EUV photoresists |
Integrated Report 2022 005
CORE COMPETENCE 2
World-leading high purity processing technology |
Level of impurities in cutting-edge products | |
Continuously satisfying customer | Less than |
expectations by strengthening | 1/1,000,000,000,000 |
manufactured capital | |
Value Creation Story
Initiatives to Address Material Issues | Data Section |
for Enhancing Corporate Value | |
Highlights 2022
Consolidated net sales
¥175.4 billion
In addition to microprocessing technology, the second core competence of TOK is high-purity processing technology, which has been continuously upgraded since the foundation of the company.
TOK released many "Japan's first" fine chemical products leveraging high-purity processing technology and they satisfied many social expectations in the early post-war era in Japan. Through subsequent global expansion, TOK provides customers across the world with materials stably produced from its robust manufactured capital to substantially contribute to higher productivity (yield) and resource saving by world-leading semiconductor manufacturers.
Source
1940 Original management principles presented by Founder Shigemasa Mukai
-"Create a frank and open-minded business culture, continue efforts to enhance our technology, raise the quality levels of our products, and contribute to society"
Consistently satisfy social expectations with high-purity processing technology
Source | Social | Social | |||
Foundation | Create a frank | 1930-40s | expectations | 1950s | expectations |
Safety of | Development of | ||||
and open-minded | |||||
business | workers | culture |
culture
Shigemasa Mukai, | Examples of | Examples of final products | ||||||||||||||||||||||||||||||||||
TOK founder | final products | Black-and-white TVs | ||||||||||||||||||||||||||||||||||
Batteries used in hard | O | u | t | put | s | |||||||||||||||||||||||||||||||
hat lights for coal miners | ||||||||||||||||||||||||||||||||||||
The first high-purity | ||||||||||||||||||||||||||||||||||||
Outputs | potassium silicate produced | |||||||||||||||||||||||||||||||||||
The first high-purity potassium | in Japan, Ohka Seal | |||||||||||||||||||||||||||||||||||
hydroxide produced in Japan | ||||||||||||||||||||||||||||||||||||
*1 1 ppm = 1/1,000,000; 1 ppb = 1/1,000,000,000; 1 ppt = 1/1,000,000,000,000 *2 Includes estimates by TOK for the decades shown
006 TOKYO OHKA KOGYO CO., LTD.
Semiconductors
High-purity chemicals and photoresists from TOK
Trends in level of high-purity processing (impurities)*1*2
2020s | Strengthening of | ||
2000s | impurities | manufactured | |
Level of | capital | ||
1970s | impurities | ≤ 1 ppt | |
Level of | |||
Level of | ≤ 100 ppt | ||
impurities |
≤ 1 ppm
Social | Social | Customer | ||||||||||||||||||||||||||||||||||||||
1970s*2 | expectations | 2000s*2 | expectations | 2020s | expectations | |||||||||||||||||||||||||||||||||||
Higher | Resource saving | Higher | ||||||||||||||||||||||||||||||||||||||
productivity | purification | |||||||||||||||||||||||||||||||||||||||
and environmental |
contribution
Value provided | Value provided | Value provided |
Higher yield in | Reduced material loss | Pursuing ultimate defect |
semiconductor | in semiconductor/LCD | reduction with state-of- |
production | production | the-art equipment |
Outputs | Outputs | Outputs |
High-purity chemicals and | High-purity chemicals and | High-purity chemicals and |
semiconductor photoresists | semiconductor photoresists | semiconductor photoresists |
Integrated Report 2022 007
CORE COMPETENCE 3
Customer-oriented strategies |
Overseas sales growth rate | |
Increasing social and | over the past 10 years*1 |
2.9 times | |
relational capital through | |
Value Creation Story
Initiatives to Address Material Issues | Data Section |
for Enhancing Corporate Value | |
Highlights 2022
Number of employees
(consolidated)
1,950
human capital-oriented management |
Customer-oriented strategies are TOK's strengths that continuously advance the benefits of microprocessing and high-purity processing technology, and TOK delivers them to all parts of the world.
TOK opened its first overseas site in 1987 and accelerated overseas expansion as the offshoring of the semiconductor industry proceeded. In 2012, the company established a customer-oriented site in South Korea, where human resources from the development, manufacturing, and marketing functions work in collaboration.
The company also promoted the same strategies in Taiwan and the United States to upgrade human capital. TOK is now engaged in long-run research and development activities based on the frank and open-minded business culture and a close relationship of trust with customers.
Continuously expanding social and relational capital to all parts of the world
Overseas | Overseas | Overseas | |||
1987 | expansion | 1998 | expansion | 2004 | expansion |
USA | Taiwan | China |
First overseas site | First overseas site in Asia | First manufacturing site in China |
Ohka America, Inc. | TOK Taiwan Co., Ltd. | Chang Chun TOK (Changshu) Co., Ltd. |
(present Tokyo Ohka Kogyo America, Inc.) | (Miaoli Plant) | (Changshu Plant) |
Continuously contributing to a sustainable future through chemistry through long-run research and development with human capital-oriented management
Long-run researchanddevelopment
(approx. 10 years) | Release and | ||||||||||||||||||||||||||
Photoresists for | gro | w | t | h | i | n | |||||||||||||||||||||
image sensors | 2003 | ||||||||||||||||||||||||||
*1 FY 2013/3 vs. FY 2022/12 | EUV photoresists | ||||||||||||||||||||||||||
008 TOKYO OHKA KOGYO CO., LTD. |
Overseas | ||
sales ratio | ||
Intel Corporation | Texas Instruments Inc. | 82.2% |
EPIC Distinguished | Supplier Excellence | |
Supplier Award | Award | |
(2022) | (2022) | |
Micron Supplier Award | ||
(2022) |
Fostering | ||||||
human capital | ||||||
Customer- | Customer- | Customer- | ||||
2012 | oriented | 2014 | oriented | 2016 | oriented | |
South Korea | Taiwan | Taiwan |
The trifecta of development, | Upgrading the customer-oriented strategies | The trifecta of development, | ||||||||||||||||||||||||||||||
manufacturing, and marketing | TOK Taiwan Co | ., | Lt | d. | manufacturing, and marketing | |||||||||||||||||||||||||||
TOK Advanced Materials Co., Ltd. | (Tongluo Plant) | TOK Taiwan Co., Ltd. | ||||||||||||||||||||||||||||||
(Tongluo No. 2 Plant) |
Growth in | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2019 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Long-run research and development | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
(approx. 10 years) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MEMS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
materials | Release and | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Long-run research and development | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
growth in | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
(approx. 20 years) | 2019 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Integrated Report 2022 009
IMPACT ENABLER
TOK Photoresists |
Collecting internal and external management resources to pursue the generation of a positive social impact
In reference to the history of TOK, the company is confident that the generation of a positive social impact will be led through initiatives to enhance the happiness of stakeholders and to improve the interaction and synergy of internal and external management resources with human capital-oriented management at the core.
The advancement of semiconductor technology underlies the positive social impact generated by the communications revolution through the ongoing dissemination of 5G and the next-generation 6G specifications. The company believes that semiconductors will grow to an unprecedented scale and substantially contribute to the achievement of carbon neutrality as a social requirement of humankind.
Interaction and synergy | ||||
Product Portfolio | Fields of application | |||
among capitals | ||||
Value Creation Story | Initiatives to Address Material Issues | Data Section | ||
for Enhancing Corporate Value | ||||
Therefore, the TOK Group reselected information terminals, cloud computing, sensing and IoT, and green energy as the four fields in which the Group will grow together with customers from the semiconductor industry; consequently, TOK decided to intensively invest human capital and all other management resources in these fields.
The product portfolio of TOK, which features semiconductor photoresists and high-purity chemicals, will continue to contribute to value creation in each field. TOK will also contribute to the generation of a positive social impact toward a sustainable future by further accelerating R&D and marketing products that promote innovation.
Social issues | Solutions and value chain | Expected social impact |
(examples) | ||
Package materials and MEMSmaterials | Information | |||||||
Human | ArF excimer laser photoresists | EUV photoresists | terminals | |||||
capital | ||||||||
High-puritychemicals | KrF excimer laser | |||||||
Cloud | ||||||||
computing | ||||||||
Intellectual | ||||||||
capital | ||||||||
g/i- | Sensing | |||||||
and IoT |
Widening economic
disparity due to
digital divide
Increasing power
consumption due to the rapid expansion of data centers
Economic loss due to increased deaths
from traffic accidents
[TOK] Development and provision of thick-film KrF excimer laser photoresists
▾
[Semiconductor manufacturers and device manufacturers] Cost reduction per byte with increased layers of 3D-NAND Production and marketing of low-price smartphones
[TOK] Development and provision of EUV photoresists
▾
[Semiconductor manufacturers and device manufacturers]
Reduction of power consumption per computational
session by logic semiconductors
Reduction of power consumption at data servers
[TOK] Development and provision of
image sensor photoresists
▾
[Semiconductor manufacturers and device manufacturers]
Advancement and mass production of
automotive image sensors
Increased production of ADAS vehicles
Provision of information and educational infrastructure
to 4million people
in developing countries*1
Reduction of global power
consumption by about
0.3%*2 (forecast 2030)
Reduction of annual deaths
from traffic accidents by about 30,000*3 (about 2% of the total)
Manufactured | Linephotoresists | |
capital | ||
Green | ||
photoresists | ||
energy | ||
Social and | ||
relational | ||
capital |
[TOK] Development and provision of photoresists | ||
for next-generation power semiconductors | ||
▾ | Reduction of global power | |
Improving efficiency of | [Semiconductor manufacturers and device manufacturers] | consumption by about |
renewable energy systems | Advancement and mass production of | 0.4%*4 (forecast 2030) |
next-generation power semiconductors | ||
Improved efficiency of EVs and | ||
wind/hydropower generation systems |
*1 Estimated based on the number of non-smartphone owners and the effect of device price reduction. The population with 30 US dollars as the down payment for installment payments exceeding 5% of annual income is defined as the population who cannot purchase smartphones.
*2 Estimated using power consumption by data center servers and the sustained effects of Moore's law as key factors. The use of high-end logic semiconductors only includes data centers and excludes servers and laptop PCs placed elsewhere.
*3 Estimated using deaths from traffic accidents and the ratio of ADAS vehicles. The estimation is based on fatal accidents in 2020 and excludes anticipated increases through to 2030 in emerging countries with many fatal traffic accidents.
*4 Estimated using power consumption in wind/solar power generation, EVs, and data centers, and the dissemination of next-generation power semiconductors with SiC and GaN as key factors. Train cars and commercial vehicles are excluded.
010 TOKYO OHKA KOGYO CO., LTD. | Integrated Report 2022 011 |
IMPACT ENABLER
TOK Photoresists |
Global market size for semiconductor photoresists
(Based on sales in 2022*1)
2,589,575,000 US dollars
Increased by 6.5% year-on-year
TOK's market share for semiconductor photoresists
(based on estimated shipment quantity 2022*2)
EUV | ArF excimer | KrF excimer | g/i-Line |
photoresists | laser photoresists | laser photoresists | photoresists |
38.0% | 16.2% | 36.6% | 22.8% |
Global No.1 | Global No.4 | Global No.1 | Global No.1 |
Market growth forecast for semiconductor photoresists (from 2021 to 2028)*3
- EUV photoresists | - ArF excimer laser photoresists |
CAGR | CAGR |
- KrF excimer laser photoresists | - g/i-Line photoresists |
Value Creation Story | Initiatives to Address Material Issues | Data Section |
for Enhancing Corporate Value | ||
Contents
Value Creation Story
003 A Society We Aim For
004 CORE COMPETENCE 010 IMPACT ENABLER 016 OUTPUT & OUTCOME 018 PORTFOLIO
020 CAPITAL
022 CULTURE & BUSINESS MODEL 024 VALUE CREATION PROCESS 026 STAKEHOLDER ENGAGEMENT 028 OUR MATERIAL ISSUES
030 Message from the President
036 Message from the Officer in Charge of Accounting and Finance
040 Review of the Two Past Medium-Term Plans/ Positioning of TOK Vision 2030 and Medium-Term Plan 2024
044 Review of Operations by Segment
Initiatives to Address Material Issues for Enhancing Corporate Value
050 Our Material Issues/
Key Initiatives and Risks and Opportunities and List of Objectives 054 Message from the Director in Charge of Marketing and Development
058 Message from the Director in Charge of New Businesses Development/ Message from the Officer in Charge of DX
060 Message from the Officer in Charge of General Affairs and Human Resources
064 Message from the Director in Charge of the Environment
068 TCFD-based Information Disclosure concerning Climate Change 070 Directors and Officers
072 Messages from Outside Directors 076 Corporate Governance
092 Global Environmental Conservation Considering Future Generations 102 Supply Chain Sustainability
Data Section
108 Trends of Key Ten-Year Data and Analysis
117 Photoresist Data
118 Consolidated Financial Statements
123 Stock Information
124 Global Network
126 Corporate Information/External Evaluation
127 Third-Party Verification Report
Editorial Policy
CAGR | CAGR | |||||
6.9% | 5.7 | |||||
% |
*1 Calculated by TOK based on aggregation by SEMI
*2 Source: Fuji Chimera Research Institute, Current Status and Future Outlook of Cutting-edge/NoticeableSemiconductor-related Markets 2023
*3 Based on the actual shipment in 2021 and the estimated shipment in 2028 (calculated based on Fuji Chimera Research Institute, Current Status and Future Outlook of Cutting- edge/Noticeable Semiconductor-relatedMarkets 2023)
Scope and time frame of this report
- Time frame: Fiscal year ended December 31, 2022 (January 1, 2022, to December 31, 2022)
(Includes some content after January 2023)
- Organization: Tokyo Ohka Kogyo Co., Ltd., and its consolidated subsidiaries and equity method affiliates
(See pages 124-125 "Global Network") unless otherwise specified in the text
• Publication on the website:
Information on the various initiatives related to financial and nonfinancial information, including information not presented in this integrated report, can be found on the company's website. https://www.tok.co.jp/eng
Reference guidelines
- International Integrated Reporting Framework promoted by the IFRS Foundation
- Guidance for Integrated Corporate Disclosure and Company-Investor Dialog for Collaborative Value Creation 2.0 published by the Ministry of Economy, Trade and Industry
- Environmental Reporting Guidelines 2018 published
by the Ministry of the Environment
• ISO 26000: 2010 - Guidance on Social Responsibility released by the Japanese Standards Association
• GRI Sustainability Reporting Standards
Forward-looking statements and estimates
This integrated report contains forward-looking statements, forecasts, and social impact estimates that present the future prospects of Tokyo Ohka Kogyo Co., Ltd., (the Company) in terms of business planning, earnings, and management strategies. Such statements are based on management judgment and estimates and are derived from information available at the time the information was prepared. Readers are cautioned not to rely solely on this report because actual results, management strategies, and social impact may substantially differ from those discussed in this report due to changes in the business environment and other conditions.
012 TOKYO OHKA KOGYO CO., LTD.
Integrated Report 2022 013
IMPACT ENABLER
TOK's Photoresists |
Value Creation Story | Initiatives to Address Material Issues | Data Section |
for Enhancing Corporate Value | ||
Our Strength
Providing photoresists as an impact enabler in both the front-end process and the back-end process of semiconductor manufacturing
Wireless bonding contributes to downsizing, weight reduction, and higher performance
Providing Customers with Inputs That Contribute to Innovation
TOK's photoresists provide customers with inputs that serve as the starting point for the customer's value creation process and contribute to the generation of a positive social impact through innovation by substantially upgrading the quality of customers' outputs in terms of semiconductor performance, quality, and yield. This section describes the functions, performance, and core value provided by TOK's photoresists in the semiconductor manufacturing process.
In this method, projected connection terminals called "bumps" are laid out at the bottom of the IC chip without using fine metal wire and are energized by coming into direct contact with the printed circuit board. By saving space for wire connections, the IC chip is directly connected to the printed circuit board, which reduces
the connection distance and contributes to downsizing, weight reduction, and the higher performance of semiconductor packages.
IC Chip | |
Printed circuit | |
board | Wireless bonding |
Bumping process | ||||||
TOK's products | ||||||
Bump | are used | |||||
Positive photoresists | ||||||
Electrode | ||||||
Plating |
Resist patterning | Plating process |
Plating is melted | Peeling of resist |
with heat for bond- | |
ing to substrates |
TOK's Semiconductor Photoresist Business | ||||
Process of making integrated circuits on a silicon substrate and producing | Also see our informational video | |||
semiconductor chips. The process uses photoresists' resistance to etching. | ||||
concerning TOK's contribution. | ||||
In this process, individual semiconductor chips are cut out to be sealed into different packages.
The process takes advantage of the thick file forming capacity of photoresists.
Semiconductor chips completed
Each diced wafer becomes |
Semiconductor
manufacturing Front-end processes of semiconductor manufacturing flow
(1) Coating of photoresists | (3) Development | |||||||||||||
Coat the photosensitive resin | Photoresist patterns are formed. | |||||||||||||
Side view | photoresists. | |||||||||||||
Photoresists | ||||||||||||||
Examples of | ||||||||||||||
photoresist patterns | ||||||||||||||
Oxide films | Silicon wafer | |||||||||||||
("wafer") |
(5) Removal of photoresists | (7) Formation of insulation film and wiring | ||
Residual photoresist is removed | Aluminum or copper wirings are | ||
from the wafer. | formed. | ||
Wiring | |||
Insulation film
Back-end processes of semiconductor manufacturing
(9) Completion of an integrated circuit |
Multiple ICs are created on the |
wafer surface using microprocess- |
ing technology. |
Cross-section |
of a completed |
- Dicing of wafers Wafer is diced into chip sizes.
an IC chip. |
(2) Exposure | (4) Etching | (6) Formation of a semiconductor field |
(8) Formation of integrated circuits | integrated circuit |
A photomask (circuit design) is | Patterns are formed in the etching | A semiconductor field is formed by |
transferred to the photoresist. | process. (Photoresist works as a | coating with an impurity diffusion agent |
protective film.) | and baking at high temperatures. |
ICs are formed by repeating the
processes (1) through (7).
Global No.1
* Based on the projected shipment volume of EUV, ArF, KrF, g-/i-Line
Global market
share for
TOK
26.1%
photoresists in 2022 (calculated based on Fuji Chimera Research Institute, Current Status and Future Outlook of Cutting-edge/NoticeableSemiconductor-related Markets 2023)
semiconductor photoresists*
Impact enabler: | Factors Adding Value to | ||
TOK's photoresists | Semiconductor Photoresists | ||
Sensitivity | Resolution | Roughness* | |
*Fluctuations in line width | |||
Etching resistance | Substrate | Processing | |
adhesiveness | applicability | ||
Purity | Substance safety | Cost |
Core value of TOK
We can swiftly provide finely tuned tailor-made photoresists for the different needs and requirements of each customer or process
Customer A Customer B Customer C
Process | Process | Process |
A | B | C |
Process | Process | Process |
1 | 2 | 3 |
Process | Process | Process |
I | II | III |
Innovation and
social impact
led by semiconductors
and final products/
services
014 TOKYO OHKA KOGYO CO., LTD. | Integrated Report 2022 015 |
OUTPUT & OUTCOME
Outputs - Full Portfolio
TOK has developed strong niche domains in both the front-end processes and back-end processes of semiconductor production with strengths in both miniaturization and 3D packaging. As a long- established supplier of photoresists, TOK provides a full portfolio comprising both the legacy and cutting-edge fields. The Company also provides cutting-edge value while seeking synergy in high- purity chemicals as non-photosensitive materials.
Global | 1 | Global | 1 | Global | 1 | |||||||||||
.1* | .1* | .1* | ||||||||||||||
No | EUV | No | KrF excimer | No | g-Line and | |||||||||||
photoresists | laser photoresists | i-Line photoresists | ||||||||||||||
Global | 1 | |||||||||||||||
.4* | ||||||||||||||||
No | ArF excimer | Materials for SiC/GaN | Electronic beam (EB) | |||||||||||||
Semiconductor | ||||||||||||||||
laser photoresists | power semiconductors | photoresists | ||||||||||||||
manufacturing | ||||||||||||||||
field | Interlayer insulating | Diffusing agents | Protective coating | |||||||||||||
films | materials | |||||||||||||||
Directed Self-Assembly | ||||||||||||||||
(DSA) materials | ||||||||||||||||
Semiconductor | ||||||||||||||||
packaging | Bump photoresists | Wafer level CSP | ||||||||||||||
manufacturing | photoresists | |||||||||||||||
field | ||||||||||||||||
Image sensor | Photosensitive | Microlens | ||||||||||||||
permanent film materials | photoresists | |||||||||||||||
MEMS | ||||||||||||||||
manufacturing | ||||||||||||||||
field | Lift-off photoresists | |||||||||||||||
3D packaging | Adhesive materials | |||||||||||||||
field | ||||||||||||||||
Clean solutions | Thinners | Developing solutions | |
High-purity | Organic chemicals | Stripping solutions | Inorganic chemicals |
chemicals | |||
Surface modifiers
Panel | TFT photoresists | Color filter |
photoresists | ||
manufacturing | ||
field | Photoresists for | High-reliability |
Organic EL | transparent materials |
*1 Based on the share of projected shipment volume in 2022 (calculated based on Fuji Chimera Research Institute, Current Status and Future Outlook of Cutting-edge/NoticeableSemiconductor-related Markets 2023)
016 TOKYO OHKA KOGYO CO., LTD.
Value Creation Story | Initiatives to Address Material Issues | Data Section |
for Enhancing Corporate Value | ||
SDGs to which we contribute
Outcomes - Contribution to a Sustainable Earth and Human Society
Against the backdrop of increasing climate change and the risks of infectious disease, semiconductor demand has shifted to a substantially different phase. Semiconductor materials in all areas, including not only the cutting-edge field but also the legacy field, have become indispensable for achieving
a sustainable earth and human society. TOK provides a stable supply of these materials under its purpose to contribute to a sustainable future through chemistry.
OUTCOME | |||
Information Terminals | |||
Smartphones | |||
Tablet devices | Higher | ||
PCs | |||
performance of | |||
Wearable devices | |||
devices | |||
Cloud Computing | Energy-saving | ||
Miniaturization | |||
Data servers | |||
AI/Metaverse | |||
Supercomputers | |||
Gaming services | |||
Sensing & IoT | |||
AI | |||
Autonomous vehicles/ | |||
ADAS | |||
Robotics | |||
Convenient/ | |||
Green Energy | comfortable | ||
Decarbonization/ | Safe/secure | ||
Environment- | |||
renewable energy | |||
equipment | friendly living | ||
Eco-cars | |||
Semiconductor
manufacturing lines Panel manufacturing lines
Contribution to a | |
TVs | sustainable earth |
and human society | |
Displays | |
Smartphones | |
Tablet devices | |
Integrated Report 2022 017
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TOK - Tokyo Ohka Kogyo Co. Ltd. published this content on 06 November 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 06 November 2023 06:50:48 UTC.