[Link] [March 24, 2022 - Taipei, Taiwan]
Test Research, Inc. (TRI) has certified several SPI Models, IPC-CFX compliant. The certified SPI series are the TR7007 SII, TR7007D, TR7007Q, TR7007 SII Ultra, and TR7007Q Plus.

The TRI's SPI platforms can also inspect bumps, flux, glue, bare board, and overall surface. The preloaded smart inspection algorithms ensure fast product changeovers, minimal idle time, and operator workload reduction.

The smart SPI solutions ease data exchange between the production line and the MES of your choice to enable data traceability for the connected factory. TRI's SPI platforms facilitate data exchange for closed-loop and support the IPC Connected Factory Exchange (CFX) and the IPC Hermes 9852 standards.

Please visit the link below to learn more about TRI's Smart Factory solutions:

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From 3D Solder Paste Inspection (SPI), 2D and 3D Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), Functional Testers (FCT) and In-Circuit Testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.


About IPC-CFX

IPC-CFX (Connected Factory Exchange) is an industry-developed open international standard forming the foundation/backbone of Factory of the Future applications. IPC-CFX is a plug-and-play solution that simplifies and standardizes machine-to-machine communication while also facilitating machine-to-business and business-to-machine applications. Learn more at https://www.ipc.org/ipc-cfx.

Attachments

  • Original Link
  • Original Document
  • Permalink

Disclaimer

TRI - Test Research Inc. published this content on 24 March 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 24 March 2022 07:37:00 UTC.