TDK Corporation has introduced a new multilayer low-pass filter for LTE and other next-generation high-speed wireless communication systems. The new filter with ordering code DEA071910LT-4003B1 achieves a miniaturized footprint of 0.65 mm x 0.5 mm and a slimmer insertion height of just 0.3 mm (form factor of 06505) to enable low-profile designs and module integration. As a result, the new multilayer low-pass filter is more than 50% smaller than previous components with a conventional case size of IEC 1005 (1.0 mm x 0.5 mm x 0.4 mm). At the same time it offers equal or even superior insertion loss and attenuation performance.

Mass production of the new low-pass filter started in January 2015. The new DEA071910LT-4003B1 multilayer low-pass filter has an operating temperature range of -40°C to +85°C and is suitable for use in the RF circuitry of smartphones, tablets and other mobile devices for LTE. The main applications of the new filter include: RF circuitry in smartphones, tablets and other mobile devices for LTE and other next-generation high-speed wireless communication systems. The filter features: volume of more than 50% smaller than existing products and equal or better performance; and miniaturized footprint and insertion height that enable low-profile designs and module integration.