Taiwan IC Packaging Corporation

3372

TW0003372009

Semiconductors

End-of-day quote Taipei Exchange Other stock markets 23:00:00 16/07/2024 BST			5-day change	1st Jan Change
23.35 ^TWD	+2.41%		+0.21%	+61.03%

06-12	Taiwan IC Packaging Corporation Appoints Liu,Chien-Chung as Member of Audit Committee	CI
06-12	Taiwan IC Packaging Corporation Appoints Liu,Chien-Chung as Member of Compensation Committee	CI

Taiwan IC Packaging Corporation Appoints Liu,Chien-Chung as Member of Audit Committee

June 12, 2024 at 08:01 am

Taiwan IC Packaging Corporation announced change of member of audit committee. Name of the new position holder: LIU,CHIEN-CHUNG; Resume of the new position holder: Chairman and General Manager of Bestcom Infotech Corp. Effective date of the new member is June 12, 2024.

Latest news about Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation Appoints Liu,Chien-Chung as Member of Audit Committee	06-12	CI
Taiwan IC Packaging Corporation Appoints Liu,Chien-Chung as Member of Compensation Committee	06-12	CI
Taiwan IC Packaging Corporation Elects Liu,Chien-Chung as Director	06-12	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the First Quarter Ended March 31, 2024	05-13	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Full Year Ended December 31, 2023	03-06	CI
Taiwan Ic Packaging Corporation Announces Resignation of Cheng Yen-Wei as Independent Director	02-01	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	11-03	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	01/08/23	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the First Quarter Ended March 31, 2023	10/05/23	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the First Quarter Ended March 31, 2023	10/05/23	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Full Year Ended December 31, 2022	13/03/23	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	04/11/22	CI
Taiwan IC Packaging Corporation(TPEX:3372) dropped from S&P Global BMI Index	19/09/22	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	01/08/22	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the First Quarter Ended March 31, 2022	03/05/22	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Full Year Ended December 31, 2021	01/03/22	CI
Taiwan IC Packaging Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	02/11/21	CI
Taiwan IC Packaging Corporation(TPEX:3372) added to S&P Global BMI Index	20/09/21	CI
Taiwan Ic Packaging Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2021	04/08/21	CI
Taiwan Ic Packaging Corporation Reports Earnings Results for the First Quarter Ended March 31, 2021	06/05/21	CI
Taiwan Ic Packaging Corporation Reports Earnings Results for the Full Year Ended December 31, 2020	04/03/21	CI
Taiwan Ic Packaging Corporation Reports Earnings Results for the Third Quarter Ended September 30, 2020	09/11/20	CI
Taiwan Ic Packaging Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2020	04/08/20	CI
Taiwan Ic Packaging Corporation Reports Earnings Results for the First Quarter Ended March 31, 2020	06/05/20	CI
Taiwan Ic Packaging Corporation Reports Earnings Results for the Full Year Ended December 31, 2019	05/03/20	CI

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Company Profile

Taiwan IC Packaging Corporation is principally engaged in the packaging of integrated circuits (ICs). The Company operates its businesses through packaging of lead frame IC products, including thin small-outline packages (TSOPs), small-outline packages (SOPs) and quad flat packages (QFPs), as well as the packaging of advanced IC products, including thin IC packages and other products. Its products are applied in the manufacture of consumer electronics, computer peripheral products, power management products, drive components, mobile phones, wireless communication products, IC tags and memory cards for portable electronic products. The Company distributes its products primarily in Taiwan, America and Asia.

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Semiconductors

Calendar

29/07/2024 - Q2 2024 Earnings Release (Projected)

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