POET Technologies Inc. announced a novel Optical Interposer Platform, which facilitates the co-packaging of electronics and optics in a single Multi-Chip Module (MCM). Based on its previously announced Dielectric Waveguide technology, POET’s Optical Interposer provides the ability to run electrical and optical interconnections side-by-side on the same interposer chip at a micrometer scale. The optical interposer represents an integral part of POET’s hybrid integrated optical engines and leverages the manufacturing processes and unique capabilities of its dielectric waveguides. As the need for higher data transfer speeds at greater baud rates and lower power levels increase, optics will move increasingly closer to the source of the data, whether it be a processor, application specific integrated circuit (ASIC) or field programmable gate array. POET’s Optical Interposer Platform enables an optoelectronic interconnect fabric to interface directly with the source of data to support high-speed optical data transfer from within the Multi-Chip Module. Additionally, this technology is projected to offer cost-efficient optical interconnects, allow for a reduction in components, and reduce test and assembly steps to decrease manufacturing costs. The company believes its Optical Interposer Platform targeting 100G transceiver applications is readily scalable to 200G and 400G transceiver products with minimal incremental cost. Importantly, the scalable architecture (in reach and speed) of this innovative platform has the potential to provide POET with a highly differentiated competitive advantage in data communication transceiver products. The company also announced that it has successfully completed development of the company’s low-loss dielectric waveguide stack and is readying the technology for transfer to manufacturing.