Nippon Electric Glass Co., Ltd. has developed a glass-ceramics core substrate (hereinafter referred to as the "GC CoreTM"), which has promising potential for use in next-generation semiconductor packages. In recent years, with the growing demand for data centers and the increase in data traffic due to the spread of technologies such as generative artificial intelligence, there has been a demand for higher-performance and lower-power semiconductors used in the infrastructure that supports these technologies. To improve the performance of semiconductors, it is essential to miniaturize circuits, develop chiplets, and increase the size of substrates.

However, conventional plastic core substrates make it difficult to miniaturize circuits, and they also have rigidity issues, such as deformation when mounting multiple semiconductor chips or making the substrate larger. For this reason, progress is being made in developing core substrates made of glass, which has excellent electrical properties, rigidity, and flatness, as a next-generation material to replace plastic core substrates. The GC CoreTM that NEG has recently developed is a core substrate made from a composite of glass powder and ceramic powder.

In addition to the properties of a core substrate made of glass, the new material offers the advantage of being easy to machine when making micro through-holes. Features of GC CoreTM developed by Nippon Electric Glass: Capable of being drilled with a CO2 laser: Micro through-holes need to be formed in the core substrate to electrically connect the fine metal wiring formed on the front and back sides. High-speed & crack-free: When drilling holes in ordinary glass substrates with a CO 2 laser, a certain percentage of them will develop cracks, which can lead to breakage of the substrate.

The GC CoreTM has the properties of ceramics as well, enabling high-speed, crack-free drilling. Economical and expected to reduce mass production costs: When drilling holes in ordinary glass substrates, the most common method is to use laser modification and etching to create holes to avoid cracks, but this method is technically difficult and requires capital investment. The GC CoreTM is economical because the holes can be made using a widely used CO2 laser machines, and the company expected to reduce mass production costs.

Low dielectric constant and loss tangent: The glass-ceramic material uses LTCC (low temperature co-fired ceramics), a material developed exclusively by NEG. This material has a low dielectric constant and loss tangent and reduces signal delay and dielectric loss. Thin substrates available: The GC CoreTM is stronger than glass substrates, allowing for thinner substrates, contributing to thinner semiconductors.

In addition, because it is less likely to break, it offers improved ease of handling during the semiconductor package production process. Easily change specifications to meet customers' needs: The properties of the GC CoreTM which depend on the composition and compounding ratio of glass and ceramics can be tailored to user needs. In addition to low-dielectric-constant types with excellent dielectric properties, the company also offer high-expansion types that match the thermal expansion of plastic substrates and high-strength types, making it possible to develop substrates that can be used for a wide range of applications.