Marvell Technology, Inc. and leading cabling and system partners Amphenol, Keysight Technologies, Molex and TE Connectivity (TE) this week are demonstrating copper interconnects powered by Marvell®? 224G long-reach (LR) DSP SerDes operating at 200 Gbps per lane or faster, a critical milestone in the race to scale accelerated infrastructure for AI and cloud workloads. The demonstrations are taking place during DesignCon at the Santa Clara Convention Center January 30 through February 1, 2024 in Santa Clara, California.

Cloud service providers are undertaking wide-ranging infrastructure upgrades to accommodate the insatiable demand for generative AI and other services. networking bandwidth in the cloud is growing at over 40% per year while bandwidth dedicated to AI is growing at over 100%. Boosting baseline I/O lane speed to 200G/lane represents a 2x increase in bandwidth over current 100G/lane systems. Marvell 200G/lane LR DSP SerDes are expected to be incorporated into a wide range of networking platforms that will extend the reach of copper links with cabled-backplane, cabled-host connections and other cabling solutions.

Marvell 200G/lane LR DSP SerDes will also extend copper connectivity bandwidth and enable 1.6T Active Electrical Cables (AECs). Amphenol, in collaboration with Marvell, will be showcasing a live demonstration of a cabled-fabric across multiple applications within a data center rack. The demonstration will feature Amphenol Paladin®HD2 right-angle female (RAF) board mount connector, a Paladin®HD2 pass-thru cable assembly, and UltraPass?.

UltraPass? is Amphenol's newest OverPass? solution for providing high-density, 224 Gb/s performance for near-ASIC interfaces.

In order to process the large datasets associated with AI and large language models, bandwidth improvements are needed in both the compute-oriented interfaces as well as those used to enable higher speed data networks. Keysight and Marvell will demonstrate the testing and validation of next-gen SerDes designs running at 212 Gbps per lane which are used to enable high-performance computing. This demo will be based on the latest development of the OIF-CEI 224G and IEEE 802.3dj standard bodies.

Through the collaboration with Marvell, Molex is demonstrating an OSFP SMT and DAC channel, OSFP BiPass/Flyover internal cable solution, and iHD backplane capabilities, all driven by Marvell 200G LR SerDes. In addition, Molex plans to adopt Marvell 200G DSP technology for the next evolution of Active Electrical Cables (AECs). TE is showcasing a cabled backplane architecture plus over-the-board (OTB) near-chip connectivity, utilizing 224G AdrenaLINE Catapult near-chip connector and AdrenaLINE Slingshot cabled backplane connector (cable-to-cable and cable-to-board).

The demo is being driven by Marvell 224 Gbps DSP SerDes silicon.