Lingsen Precision Industries, Ltd. Announces Cash Dividend, Payable on August 28, 2024
May 30, 2024 at 09:21 am
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Lingsen Precision Industries, Ltd. announced the cash distribution from capital surplus of TWD 114,030,704, each share is entitled to receive TWD 0.3. Ex-rights (ex-dividend) trading date is on August 01, 2024 with Ex-rights (ex-dividend) record date is on August 07, 2024. Payment date of common stock cash dividend distribution on August 28, 2024.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
LINGSEN PRECISION INDUSTRIES, LTD. 
