Inari Amertron : Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - EMPLOYEES PROVIDENT FUND BOARD
September 09, 2020 at 10:10 am
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Changes in Director's Interest (Section 219 of CA 2016)
JIANKUN INTERNATIONAL BERHAD
Information Compiled By KLSE
Particulars of Director
Name
DATUK LEE KIAN SENG
Descriptions(Class)
Ordinary Shares
Details of changes
No
Date of change
No of securities
Type of transaction
Nature of Interest
21/07/2020
7,000
Disposed
Deemed Interest
Name of registered holder
Lee Ynh Tyng
Description of 'Others' Type of Transaction
Consideration (if any)
22/07/2020
20,000
Disposed
Deemed Interest
Name of registered holder
Lee Cheng Yee
Description of 'Others' Type of Transaction
Consideration (if any)
22/07/2020
242,600
Disposed
Deemed Interest
Name of registered holder
Lee Ynh Tyng
Description of 'Others' Type of Transaction
Consideration (if any)
Circumstances by reason of which change has occurred
(1) Disposal of 7,000 ordinary shares by Lee Ynh Tyng on 21 July 2020 via open market;
(2) Disposal of 242,600 ordinary shares by Lee Ynh Tyng on 22 July 2020 via open market; and
(3) Disposal of 20,000 ordinary shares by Lee Cheng Yee on 22 July 2020 via open market.
Deemed interest pursuant to Sections 8 and 59(11) of the Companies Act, 2016.
Nature of interest
Deemed Interest
Total no of securities after change
Direct (units)
15,367,300
Direct (%)
9.210
Indirect/deemed interest (units)
17,571,000
Indirect/deemed interest (%)
10.532
Date of notice
23/07/2020
Date notice received by Listed Issuer
23/07/2020
Announcement Info
Company Name
JIANKUN INTERNATIONAL BERHAD
Stock Name
JIANKUN
Date Announced
23 Jul 2020
Category
Changes in Director's Interest Pursuant to Section 219 of CA 2016
Reference Number
CS4-23072020-00005
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Disclaimer
Inari Amertron Bhd published this content on 09 September 2020 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 09 September 2020 09:09:07 UTC
Inari Amertron Berhad is a Malaysia-based company that is engaged in the investment holding and the provision of management services. The Company operates as an outsourced semiconductor assembly and test (OSAT) service provider for radio frequency, fiber-optics transceivers, opto-electronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed, and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.