Chee Corp. (OTCPK:ECRP) announced that it has received $500,000 in a debt round of funding on March 24, 2021. The transaction included participation from Lawrence M. Silver. The company issued non-convertible promissory note in the transaction. The note bears an interest rate of 10% per annum and will mature on June 22, 2021. The note is issued at par, is unsecured and redeemable.