The Management Board of Boryszew S.A. with the seat in Warsaw (Company) informs that its subsidiary Boryszew Oberflächentechnik Deutschland GmbH (BOD) signed on 26 January 2016 with Bank Gospodarstwa Krajowego with the seat in Warsaw (Bank) a pledge agreement in order to secure the Bank's debts due to the following credits agreements concluded on 29October up to EUR 20,338,000.00 and the revolving credit agreement up to EUR 1,500,000.00:
1. A financial pledge on the BOD's Polish bank accounts connected with the granted credit up
to the highest amount of EUR 32,757,000.00.
2. A financial pledge on the BOD's Polish bank accounts connected with the granted credit up
to the highest amount of EUR 32,757,000.00.
3. A financial pledge on the BOD's German bank accounts connected with the granted credit up
to the highest amount of EUR 23,0281800.00.
4. A pledge on the BOD's stakes of the subsidiary company Boryszew Kunststofftechnik Deutschland GmbH to the highest amount of EUR 23,0281800.00.

The financial means from credit would be located for the reconstruction and development of the production workshop of galvanized/chrome plated ornamental components for first equipment for cars producers (OEM) in Prenzlau.

There are no affiliations between Boryszew S.A. and its management stuff and Bank Gospodarstwa Krajowego with the seat in Warsaw and its management stuff.
Criterion to acknowledge the assets as assets of considerable value - the pledge value exceeds the equivalent of the amount of EUR 1 million.

Signatures:
Piotr Szeliga - President of the Management Board

Translation from the original Polish version.

In the event of differences resulting from the translation, reference should be made to the official Polish version.

Boryszew SA issued this content on 27 January 2016 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 29 January 2016 14:16:23 UTC

Original Document: http://www.boryszew.com.pl/report-details?irr_id=2545