Akoustis Technologies, Inc. announced that it has received its first high-volume 5G mobile filter purchase order from its leading multi-billion-dollar Tier-1 RF component company customer. The filter is manufactured using the Akoustis XBAW process and is designed into the customer's new multiplexer product that is expected to ship in the first half of calendar 2023 as part of a major chipset OEM reference design. The filter solution leverages one of Akoustis' new wafer-level-packages (WLP), developed and manufactured in its Canandaigua, New York fab.

The new XBAW-based design is being used to address difficult coexistence issues between 5G mid-bands and Wi-Fi 6E 5 to 7 GHz bands. The customer is considering additional applications for filters using the XBAW process in future modules for 5G smartphones and other mobile devices after the successful completion of this first solution. Akoustis began shipping initial pre-production chips against customer purchase orders for development, sampling, and qualification during the quarter ending December 31, 2022.

This new order will be used by the Tier-1 RF component customer to support large volume deliveries to multiple mobile device manufacturers that will utilize a major chipset OEM reference design. The new filter solution is the first product to ship with the Company's internally developed and manufactured WLP. In response to global supply chain challenges, Akoustis has been developing proprietary chip-scale packaging (CSP) and WLP technology in its New York facility for the past year and is rapidly growing its manufacturing capacity to target the 5G mobile device market with filter products using the XBAW process.

The new CSP and WLP technologies offer significantly reduced size relative to Akoustis' current generation packages and superior in back-end manufacturing cost.