The COM-RAPC6 and COM-ADNC6 offer diverse processor lineups, exceptionally versatile interfaces, and wide-temperature operation for the needs of any industrial project.
Targeting the advanced robotics and edge gateway markets, the COM-RAPC6 is compatible with a variety of embedded CPUs from the 13th Generation Intel® Core™ Processor line on a compact 95mm x 95mm form factor. The module gives customers a range of SKUs from the 13th Generation series, from the efficient 15W Intel® Processor U300E to 13th Generation Intel® Core™ i7 Processors, running at 45W. This grants users up to 14 (6P/8E) cores and 20 threads of processing power alongside technologies for the acceleration of deep learning inference workloads and I/O device virtualization.
With the COM-RAPC6 clearly favoring high performance, AAEON’s second addition to its COM Express Type 6 product line, the COM-ADNC6, focuses on efficiency. The COM-ADNC6 offers a selection of embedded CPUs from the Intel Atom® X Series, Intel® Processor N-series, and the Intel® Core™ i3-N305 alongside 16GB of SODIMM-based LPDDR5 system memory. Given its compatible CPUs are comparable to the Intel Atom® Processor E and Intel® Celeron® Processor J Series CPUs in power consumption, but with far greater performance, the COM-ADNC6 is positioned as a natural successor to the COM-BT.
Equipped with such high processing capacity, the COM-RAPC6 is able to host up to six PCIe modules. With four single-lane PCIe slots alongside another two equipped with eight and four lanes, the COM-RAPC6 is able to handle advanced graphics card installation for multi-LAN expansion. Such operation is boosted by up to 64GB of SODIMM-based DDR5 memory, which provides flexible, high-bandwidth system memory.
Much like the COM-RAPC6, the COM-ADNC6 also offers a range of PCIe expansion options, able to accommodate either four single-lane or two dual-lane PCIe expansion cards. Consequently,
The COM-RAPC6 offers a total of five display outputs, comprised of three DDI (4K @120Hz), VGA (1920 x 1080) and eDP (4K @60Hz) co-layed with single or dual-channel LVDS (1920 x 1080) to achieve four simultaneous displays.
Such a configuration is boosted by Intel® Iris® Xe Graphics or Intel® UHD Graphics for 13th Gen Intel® Processors, depending on the SKU. Meanwhile, the COM-ADNC6 provides eDP (4K @60Hz) co-layed with single or dual-channel LVDS (1920 x 1080) alongside two DP connectors for 4K display at 144Hz.
Onboard communication protocols for both modules come in the form of a 2-wire UART, 8-bit GPIO, and SMBus. A variety of other functions are available via LPC connectors, with which multiple serial port functions can be accessed.
The two boards share a number of features that make them conducive to industrial environments, such as wide-temperature SKUs able to reliably operate in a -40°C to 85°C window, while for storage both support two SATA at 6Gb/s. This flexibility is further reflected in the modules’ remaining onboard interfaces, with LAN connectors for the Intel® Ethernet Controller I226 Series platform running at 2.5GbE speeds, a variety of USB connectors, and high-definition audio output.
For more information about the COM-RAPC6 and COM-ADNC6, please visit the COM Express Modules lineup on the
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