Kathy Cook

Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC.

SUSS Microtec, Inc. supplies precision technology products. It provides innovative solutions for markets including advanced packaging, MEMS, Nanotechnology, compound semiconductor, silicon-on-insulator and 3D Interconnect. The company also manufactures a complete line of photoresist and dielectric coat/bake/develop systems, microlithography exposure systems, wafer and device bonders, probers, photomasks, cleaners, and etchers. It was founded by Karl Süss in 1949 and is headquartered in Waterbury Center, VT.

EMD Millipore Corp. engages in the provision of laboratory materials, technologies, and services to the life science industry. The company was founded by Jack Bush in 1954 and is headquartered in Burlington, MA.

ULVAC Technologies, Inc. designs, manufactures and markets equipment and materials for industrial applications. It offers heliot repair, vacuum pump repair, shield cleaning, nano metal inks, and refurbished equipment. The company was founded in 1992 and is headquartered in Methuen, MA.