Shinkawa Ltd. has developed the latest versions of leading products, wire bonders UTC-5000Super and UTC-5000NeoCu Super and started accepting orders. Features of UTC-5000Super/UTC-5000NeoCu Super: High-speed wire bonder with new SimLoop function as standard capability: Optimizing loop shapes automatically by newly developed loop shaping engine; Enabling intuitive loop shape adjustment with loop display function; Significantly reducing parameter setup time using loop templates; Improving UPH by about 7% with built-in overdrive function; The SimLoop kit, which enables the SimLoop function on existing equipment (UTC-5000 and UTC-5000 NeoCu), will be released at the same time. The wire bonder UTC-5000 NeoCu Super will be exhibited at SEMICON Japan 2018 from 12 to 14 December 2018.