The Company's Board of Directors elected the
Chairman and the Vice-Chairman
Date of events
2022/06/17
To which item it meets
paragraph 6
Statement
1.Date of the board of directors resolution or date of occurrence of the
change:2022/06/17
2.Position (Please enter chairperson or president/general manager):
Chairman and Vice-Chairman
3.Name of the previous position holder:
Chairman:Chin-Tsai Chen (Dennis Chen)
Vice-Chairman:Yu-Chi Wang (YC Wang)
4.Resume of the previous position holder:
Chairman:Chin-Tsai Chen (Dennis Chen), Chairman and President of WIN
Semiconductors Corp.
Vice-Chairman:Yu-Chi Wang (YC Wang), Vice-Chairman and Chairman of Technology
Development Strategy Committee, WIN Semiconductors Corp.
5.Name of the new position holder:
Chairman:Chin-Tsai Chen (Dennis Chen)
Vice-Chairman:Yu-Chi Wang (YC Wang)
6.Resume of the new position holder:
Chairman:Chin-Tsai Chen (Dennis Chen), Chairman and President of WIN
Semiconductors Corp.
Vice-Chairman:Yu-Chi Wang (YC Wang), Vice-Chairman and Chairman of Technology
Development Strategy Committee, WIN Semiconductors Corp.
7.Circumstances of change (Please enter "resignation", "dismissal",
"term expired" , "job relocation", "severance", "retirement",
"death" or "new appointment"):term expired
8.Reason for the change:Election as the previous tenure expired
9.Effective date of the new appointment:2022/06/17
10.Any other matters that need to be specified:None
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WIN Semiconductors Corp. published this content on 17 June 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 17 June 2022 08:52:06 UTC.
WIN Semiconductors Corp is a Taiwan-based company principally engaged in the provision of gallium arsenide wafers original equipment manufacturer (OEM) services. The Company provides semiconductor manufacturing technology and customer-related layout services and wafer automated circuit testing, automated inspection and other services. In the microwave high-tech field of wireless broadband communications, the Company mainly provides heterojunction bipolar transistors (HBT) and pseudomorphic high electron mobility transistors (pHEMT). In optical communications and 3D sensing field, the Company provides the development and manufacturing service of optoelectronic products. The Company is also developing optoelectronic component technology in automotive, data center and fiber-related applications. The Company's products are mainly sold to Asia, America, Europe and Taiwan.