Nextronics Engineering Corp. (GTSM:8147) announced a private placement of 600 unsecured convertible bonds at a price of TWD 100,000 per bond for gross proceeds of TWD 60,000,000 on August 14, 2020. The transaction included participation from returning investor SINBON Electronics Co., Ltd. (TSEC:3023).
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- News Nextronics Engineering Corp.
- Nextronics Engineering Corp. announced that it has received TWD 60 million in funding from SINBON Electronics Co., Ltd.