Green Energy Technology : GET (3519TT) proprietary Wafer Cutting technology was granted Patent (More)

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GET (3519TT) proprietary Wafer Cutting technology was granted Patent

We would like to share with you that GET (3519TT) was granted patent by Taiwan Patent and Intellectual Property Office for the Company's invention on "Solar Wafers Cutting Machine fluid filtration device stability." The cutting technology, which enables GET to decrease manufacturing costs and increase yield rate, was granted following GET's previous patent of grinding technology granted in Japan, Germany, China and Taiwan.

The use of filtering device has been widely adopted in solar slicing to reduce particles of broken wafer in slurry. As tier-one high-end wafer supplier, GET needs to minimize any particle in manufacturing to guarantee wafer quality. Generally it needs to perform with periodical maintenance, however, the cleaning process would decrease manufacturing efficiency and throughput since it takes time to work on heavy equipment. With the new development of wafer cutting machine and nozzle, slurry can be filtered properly and proceed steadily, with no concern of even fine particles. The technology simplifies the time-consuming maintenance also, enables GET to save manpower and increase yield rate.

The invention has been granted patent in Taiwan, and under review process in China.

Based on the 2016 effective capacity estimated by Bloomberg New Energy Finance, wafer capacity is the bottleneck along crystalline silicon PV value chain, with around 10% less than the expanding capacities of polysilicon and solar cell. As tier one wafer maker, GET will keep developing high efficient wafer with low cost, to keep core competence of high-level technology and to cooperate with tier-1 partners.

Thank you for your attention.