Elematec : Notice of Dividend Payment from Retained Earnings
May 24, 2024 at 07:06 am
Share
May 24, 2024
To Whom It May Concern
Company
Elematec Corporation
Representative
Chief Executive Officer and Chairman of the Board
Akira Yokode
(Stock Code 2715 The Prime Market of the Tokyo Stock Exchange)
Contact
Managing Director, Director of corporate Division
Masahiro Fukami
(Tel: +81-3-3454-3526)
Notice of Dividend Payment from Retained Earnings
Elematec Corporation at the board of directors meeting held on May 24,2024 resolved to pay a dividend from retained earnings as set forth below. The record date thereof is March 31,2024.
1. Details of payment of dividends
Payment of dividends
Recent dividend forecast
Year-end dividend for
FY2023
decided on May
(Announced on
(Year ended
24,2024
April 25,2024)
March 31,2023)
Record date
March 31,2024
Same as on the left
March 31,2023
Dividend per Share
45.00
45.00
49.00
(yen)
Total amount of dividends
1,842 million yen
―
2,006 million yen
Effective date
June 27,2024
―
June
29,2023
(Scheduled)
Source of dividend
Retained earnings
―
Retained
earnings
2. Reason
As we position redistribution of profits to our shareholders as an important management issue, our basic principle is set to the amount calculated using the payout ratio (consolidated) of 50% or the DOE of 3%, whichever is higher as a guideline.
In consideration of the above, Elematec will pay a year-end dividend of 45 yen per share to shareholders of record on March 31,2024. Accordingly, annual dividend per share will be 85 yen which includes a 2nd Quarter dividend of 40 yen per share. The dividend payout ratio (consolidated) will be 64.8% and the DOE will be 5.2%.
Elematec Corporation published this content on
24 May 2024 and is solely responsible for the information contained therein. Distributed by
Public, unedited and unaltered, on
24 May 2024 06:05:03 UTC.
Elematec Corp is a Japan-based company mainly engaged in the sale, processing, design and manufacture of electric materials, electronic components and mechanical parts. The Company operates in four regional segments. The Company is engaged in the provision of electrical materials such as substrates, silicon, anisotropic conductive films (ACFs), heat radiation rubbers, high-function films and resins, insulating tapes, high-function adhesives, lens films, anti-reflective materials and inert liquid; electronic components such as connectors, sensors, thermostats, inductors, backlights, fuses and liquid crystal displays (LCDs); mechanical parts such as fiberglass reinforced plastic (FRP) molded products, filters, exterior products, solar panels, power modules and others; other products such as cable accessories, polishing agents, camera monitors and others. The Company operates within the domestic market and to overseas markets, including China, other Asia, Europe and America.