Valuation: Tera Probe, Inc.

Market Cap 111B 685M 599M 553M 510M 968M 65.32B 985M 6.6B 2.59B 32.18B 2.57B 2.52B P/E 2026 *
22.1x
P/E 2027 * 18.4x
Enterprise Value 111B 685M 599M 553M 510M 968M 65.32B 985M 6.6B 2.59B 32.18B 2.57B 2.52B EV / Sales 2026 *
1.94x
EV / Sales 2027 * 1.58x
Free-Float
36.64%
Yield 2026 *
1.23%
Yield 2027 * 1.44%
1 day+3.23%
1 week-12.39%
Current month-9.52%
1 month+31.32%
3 months+21.84%
6 months+88.53%
Current year+93.02%
1 week 11,210
Extreme 11210
13,880
1 month 9,530
Extreme 9530
14,960
Current year 6,290
Extreme 6290
14,960
1 year 3,130
Extreme 3130
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 29/02/2020
President 59 25/03/2020
Chief Tech/Sci/R&D Officer 55 29/02/2020
Director TitleAgeSince
Director/Board Member 75 31/08/2005
Director/Board Member 75 31/05/2017
Director/Board Member 59 31/08/2005
Change 5-day change 1-year change 3-year change Capi.($)
+3.23%-12.39%+280.59%+210.20% 685M
+0.87%-1.71%+149.32%+395.06% 302B
+2.30%+1.65%+165.27%+512.84% 134B
-0.87%-2.57%+264.63%+228.64% 56.29B
+9.99%-2.99%+395.17% - 37.33B
-5.80%+16.39%+703.26%+686.58% 32.88B
-1.69%+9.49%+184.83%+217.31% 15.88B
-7.00%+8.84%+457.35%+421.20% 14.93B
+0.98%-7.91%+203.94%+421.11% 11.75B
+6.66%+29.73%+159.06%+176.01% 12.41B
Average +0.87%+3.80%+296.34%+363.22% 61.83B
Weighted average by Cap. +1.08%+0.51%+217.30%+413.98%

Financials

2026 *2027 *
Net sales 57B 353M 309M 285M 263M 499M 33.66B 507M 3.4B 1.34B 16.58B 1.33B 1.3B 70B 433M 379M 350M 323M 613M 41.33B 623M 4.18B 1.64B 20.36B 1.63B 1.59B
Net income 5B 30.96M 27.08M 24.97M 23.07M 43.77M 2.95B 44.5M 298M 117M 1.45B 116M 114M 6B 37.15M 32.49M 29.97M 27.68M 52.52M 3.54B 53.41M 358M 141M 1.75B 139M 136M
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
10/07/26 JP¥12,160.00 +3.23% 107,200
09/07/26 JP¥11,780.00 +0.43% 68,100
08/07/26 JP¥11,730.00 -2.33% 116,400
07/07/26 JP¥12,010.00 -6.10% 128,900
06/07/26 JP¥12,790.00 -7.85% 124,000
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
12,160.00
Average target price
-

Quarterly revenue - Rate of surprise

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