Valuation : Tera Probe, Inc.

Market Cap 96.34B 619M 533M 500M 457M 854M 58.53B 860M 5.91B 2.3B 29.91B 2.33B 2.27B P/E 2026 *
15.3x
P/E 2027 * 11.5x
Enterprise Value 96.34B 619M 533M 500M 457M 854M 58.53B 860M 5.91B 2.3B 29.91B 2.33B 2.27B EV / Sales 2026 *
1.55x
EV / Sales 2027 * 1.2x
Free-Float
36.64%
Yield 2026 *
1.89%
Yield 2027 * 2.64%
1 day-1.21%
1 week-3.11%
Current month-6.53%
1 month+3.32%
3 months-3.55%
6 months+6.01%
Current year+68.10%
1 week 10,400
Extreme 10400
11,680
1 month 9,620
Extreme 9620
13,280
Current year 6,290
Extreme 6290
14,960
1 year 4,510
Extreme 4510
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 29/02/2020
President 59 25/03/2020
Chief Tech/Sci/R&D Officer 56 29/02/2020
Director TitleAgeSince
Director/Board Member 59 31/08/2005
Director/Board Member 55 31/05/2013
Director/Board Member 75 31/08/2005
Change 5-day change 1-year change 3-year change Capi.($)
-1.21%-3.11%+126.77%+148.01% 615M
-0.40%-6.84%+102.87%+234.02% 225B
-0.80%-9.58%+202.67%+607.51% 148B
-0.66%-9.04%+182.90%+217.42% 53.41B
+2.80%-7.34%+241.28% - 32.34B
-1.09%-2.38%+357.70%+620.55% 25.67B
-0.28%-2.81%+74.37%+197.35% 13.48B
-1.89%+0.01%+203.83%+296.12% 11.39B
-3.51%+6.97%+80.30%+261.54% 10.93B
-0.19%-3.84%+42.27%+79.40% 7.94B
Average -0.73%-5.77%+161.50%+295.77% 52.93B
Weighted average by Cap. -0.50%-7.14%+159.85%+362.24%

Financials

2026 *2027 *
Net sales 62B 398M 343M 322M 294M 549M 37.67B 554M 3.81B 1.48B 19.25B 1.5B 1.46B 80B 514M 442M 415M 380M 709M 48.61B 715M 4.91B 1.91B 24.84B 1.93B 1.89B
Net income 6.3B 40.49M 34.84M 32.69M 29.91M 55.83M 3.83B 56.27M 387M 151M 1.96B 152M 149M 8.4B 53.99M 46.45M 43.59M 39.88M 74.44M 5.1B 75.03M 516M 201M 2.61B 203M 198M
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
03/09/26 JP¥10,590.00 -1.21% 56,500
02/09/26 JP¥10,720.00 -3.68% 68,000
01/09/26 JP¥11,130.00 -1.77% 52,400
31/08/26 JP¥11,330.00 +2.07% 76,100
28/08/26 JP¥11,100.00 -3.39% 106,000
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
10,590.00
Average target price
-

Quarterly revenue - Rate of surprise

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