Valuation: Strasbaugh

Market Cap 10M 8.74M 8.06M 7.43M 14.01M 963M 14.32M 96.38M 37.91M 472M 37.55M 36.73M 1.62B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.66M 7.06M 6.51M 12.27M 844M 12.54M 84.43M 33.21M 413M 32.9M 32.18M 1.42B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 0
0.09
10 years 0
Extreme 0
0.51
Manager TitleAgeSince
Chief Executive Officer 76 30/04/2007
Director TitleAgeSince
Chairman 76 30/04/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
-5.57%-12.09%+178.12%+266.52% 421B
-3.67%-15.48%+108.19%+218.94% 72.48B
-2.97%-19.29%+186.71%+276.27% 49.56B
-8.23%-10.72%+51.21%+173.45% 43.28B
-1.30%-16.66%+42.52%-14.78% 31.54B
-3.17%-15.98%+325.85%+369.43% 29.85B
-6.81%-23.52%+168.11%+194.43% 21.38B
-4.53%-11.67%+76.24%+113.44% 20.43B
-6.49%-25.55%+203.85%+258.37% 17.59B
Average -4.27%-13.71%+148.98%+206.23% 70.66B
Weighted average by Cap. -5.09%-8.82%+161.36%+241.61%

Financials

2008 2009
Net sales 9.55M 8.35M 7.7M 7.1M 13.39M 920M 13.68M 92.09M 36.22M 451M 35.88M 35.09M 1.55B 12.87M 11.25M 10.38M 9.57M 18.04M 1.24B 18.44M 124M 48.8M 607M 48.34M 47.28M 2.09B
Net income -4.51M -3.94M -3.64M -3.35M -6.32M -434M -6.46M -43.45M -17.09M -213M -16.93M -16.56M -732M -680K -594K -548K -505K -953K -65.49M -974K -6.55M -2.58M -32.07M -2.55M -2.5M -110M
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -18.1 -0.27 -1.81 -0.71 -8.87 -0.71 -0.69 -30.52 -1.24 -1.08 -1 -0.92 -1.74 -119.41 -1.78 -11.95 -4.7 -58.48 -4.66 -4.55 -201.33
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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