Valuation : Strasbaugh

Market Cap 10M 8.62M 8.16M 7.39M 13.87M 955M 13.94M 96.89M 37.26M 486M 37.56M 36.73M 1.54B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.55M 7.15M 6.48M 12.15M 837M 12.21M 84.88M 32.64M 426M 32.9M 32.18M 1.35B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
1 week+909,900.00%
Current month+909,900.00%
1 month+909,900.00%
3 months+909,900.00%
6 months+909,900.00%
Current year+909,900.00%
5 years 0
Extreme 1.0E-6
0.01
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 30/04/2007
Director TitleAgeSince
Chairman 76 30/04/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%+909,900.00%+909,900.00%+909,900.00% 14
+0.55%+0.39%+172.04%+217.07% 362B
-0.73%-0.65%+68.15%+224.20% 68.58B
-0.18%-0.55%+135.00%+237.10% 47.37B
+1.17%+0.61%+95.57%+98.71% 47.2B
-2.99%-4.55%+26.53%+97.38% 36.71B
-1.60%-0.17%+251.83%+302.96% 26.78B
+2.15%+3.85%+48.25%-21.84% 25.76B
-1.17%+1.62%+84.28%+148.42% 19.73B
+2.80%-3.76%+69.20%+95.83% 17.75B
Average -0.00%-1.77%+91,085.09%+91,129.98% 65.22B
Weighted average by Cap. +0.19%-0.86%+137.63%+192.69%

Financials

2008 2009
Net sales 9.55M 8.23M 7.79M 7.06M 13.25M 913M 13.32M 92.57M 35.6M 464M 35.88M 35.09M 1.47B 12.87M 11.09M 10.5M 9.52M 17.86M 1.23B 17.95M 125M 47.96M 626M 48.35M 47.29M 1.98B
Net income -4.51M -3.88M -3.68M -3.33M -6.25M -431M -6.29M -43.68M -16.8M -219M -16.93M -16.56M -692M -680K -586K -555K -503K -943K -64.96M -948K -6.59M -2.53M -33.05M -2.55M -2.5M -104M
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -17.96 -0.26 -1.82 -0.7 -9.14 -0.71 -0.69 -28.87 -1.24 -1.07 -1.01 -0.92 -1.72 -118.46 -1.73 -12.01 -4.62 -60.27 -4.66 -4.55 -190.44
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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