Valuation: Strasbaugh

Market Cap 10M 8.88M 8.29M 7.56M 14.26M 961M 14.39M 100M 38.89M 491M 37.54M 36.73M 1.58B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.78M 7.26M 6.62M 12.49M 842M 12.6M 87.91M 34.07M 430M 32.89M 32.17M 1.38B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
1 week+909,900.00%
Current month+909,900.00%
1 month+909,900.00%
3 months+909,900.00%
6 months+909,900.00%
Current year+909,900.00%
5 years 0
Extreme 1.0E-6
0.01
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 30/04/2007
Director TitleAgeSince
Chairman 76 30/04/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%+909,900.00%+909,900.00%+909,900.00% 14
+3.51%+8.56%+88.35%+197.09% 715B
+2.17%+10.24%+136.40%+450.80% 435B
+2.03%+11.35%+141.53%+287.10% 429B
+3.27%+10.09%+81.60%+349.15% 270B
-3.82%+7.04%+117.27%+199.80% 174B
+2.71%+13.62%+156.76%+798.16% 177B
+0.42%+2.00%+333.43%+542.34% 98.43B
-2.07%-5.68%+36.17%+244.62% 66.67B
+8.00%+12.72%+210.70%+346.05% 70.2B
Average +1.01%+6.50%+91,120.22%+91,331.51% 243.49B
Weighted average by Cap. +1.35%+8.90%+124.61%+338.62%

Financials

2008 2009
Net sales 9.55M 8.49M 7.92M 7.22M 13.62M 918M 13.75M 95.88M 37.15M 470M 35.87M 35.09M 1.51B 12.87M 11.44M 10.68M 9.73M 18.35M 1.24B 18.52M 129M 50.06M 633M 48.33M 47.28M 2.03B
Net income -4.51M -4.01M -3.74M -3.41M -6.43M -433M -6.49M -45.24M -17.53M -222M -16.93M -16.56M -711M -680K -604K -564K -514K -969K -65.37M -978K -6.82M -2.64M -33.42M -2.55M -2.5M -107M
Net Debt -0.19 -0.17 -0.16 -0.14 -0.27 -18.07 -0.27 -1.89 -0.73 -9.24 -0.71 -0.69 -29.65 -1.24 -1.1 -1.03 -0.94 -1.77 -119.2 -1.78 -12.44 -4.82 -60.94 -4.66 -4.55 -195.58
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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