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Valuation: CHPMS TCHNLGS

Market Cap 72.8B 2.3B 2.01B 1.86B 1.74B 3.26B 217B 3.28B 22.03B 8.54B 107B 8.63B 8.45B 371B P/E 2026 *
24.7x
P/E 2027 * 17.5x
Enterprise Value 76.09B 2.4B 2.1B 1.94B 1.82B 3.41B 227B 3.43B 23.03B 8.92B 112B 9.02B 8.83B 388B EV / Sales 2026 *
2.48x
EV / Sales 2027 * 2.21x
Free-Float
78.37%
Yield 2026 *
1.18%
Yield 2027 * 1.91%
Manager TitleAgeSince
Director of Finance/CFO 54 30/09/2017
President 67 16/07/1997
Corporate Officer/Principal 60 16/04/2007
Director TitleAgeSince
Chairman 67 16/07/1997
Director/Board Member 67 27/06/2007
Director/Board Member 64 02/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
-1.09%+1.73%+154.89%+152.56% 732B
+3.97%+6.06%+329.93%+533.33% 487B
-0.95%+10.82%+214.20%+276.80% 213B
+3.03%+3.90%+324.22%+384.58% 84.99B
+1.69%+27.31%+1,841.75%+2,492.91% 36.47B
-2.39%+25.23%+234.55%+155.98% 30.62B
+13.62%+18.77%+137.03%+66.56% 27.26B
+4.66%+9.28%+348.71%+237.66% 22.42B
+1.95%+20.08%+210.52%+318.36% 19.63B
Average +2.72%+15.39%+421.76%+513.19% 183.57B
Weighted average by Cap. +1.02%+6.46%+264.48%+346.04%

Financials

2026 *2027 *
Net sales 30.69B 970M 845M 783M 733M 1.37B 91.48B 1.38B 9.29B 3.6B 45.03B 3.64B 3.56B 156B 33.32B 1.05B 918M 850M 796M 1.49B 99.33B 1.5B 10.08B 3.91B 48.89B 3.95B 3.87B 170B
Net income 3.01B 95.21M 83.01M 76.88M 71.97M 135M 8.98B 136M 912M 353M 4.42B 357M 350M 15.35B 4.26B 135M 117M 109M 102M 191M 12.71B 192M 1.29B 500M 6.26B 506M 495M 21.72B
Net Debt 3.29B 104M 90.61M 83.92M 78.56M 147M 9.81B 148M 996M 386M 4.83B 390M 382M 16.76B 797M 25.18M 21.95M 20.33M 19.03M 35.7M 2.38B 35.91M 241M 93.48M 1.17B 94.51M 92.49M 4.06B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
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