Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 50.82B 1.57B 1.37B 1.27B 1.17B 2.21B 150B 2.24B 15.01B 5.89B 74.79B 5.91B 5.78B 251B P/E 2026 *
16.9x
P/E 2027 * 11.5x
Enterprise Value 54.25B 1.68B 1.46B 1.36B 1.25B 2.36B 160B 2.39B 16.02B 6.29B 79.84B 6.31B 6.17B 268B EV / Sales 2026 *
1.8x
EV / Sales 2027 * 1.61x
Free-Float
77.34%
Yield 2026 *
1.72%
Yield 2027 * 2.86%
1 day+10.00%
1 week-20.04%
1 month-32.15%
3 months+4.01%
6 months+20.60%
Current year+53.98%
1 week 65.7
Extreme 65.7
90.8
1 month 65.7
Extreme 65.7
125
Current year 46.8
Extreme 46.8
125
1 year 23.1
Extreme 23.1
125
3 years 21.3
Extreme 21.3
125
5 years 21.3
Extreme 21.3
125
10 years 20.15
Extreme 20.15
125
Manager TitleAgeSince
Director of Finance/CFO 54 30/09/2017
President 67 16/07/1997
Corporate Officer/Principal 60 16/04/2007
Director TitleAgeSince
Chairman 67 16/07/1997
Director/Board Member 67 27/06/2007
Director/Board Member 64 02/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
+10.00%-20.04%+178.69%+103.08% 1.57B
-0.40%-8.24%+141.04%+122.49% 634B
-1.58%-3.99%+204.06%+309.30% 367B
+6.24%-11.43%+147.71%+154.06% 158B
+9.90%-9.46%+263.93%+386.84% 75.42B
+12.76%-12.18%+159.30%+71.77% 21.32B
+1.66%-7.82%+57.35%+10.56% 18.16B
+5.18%-20.50%+120.28%+224.64% 14.95B
+3.22%-5.15%+174.21%+109.87% 12.86B
+3.34%-23.23%+129.29%+68.25% 12.39B
Average +5.03%-12.34%+157.59%+156.09% 131.53B
Weighted average by Cap. +1.05%-7.82%+165.62%+191.66%

Financials

2026 *2027 *
Net sales 30.22B 936M 814M 757M 695M 1.31B 89.34B 1.33B 8.93B 3.5B 44.48B 3.51B 3.44B 149B 34.72B 1.08B 935M 870M 799M 1.51B 103B 1.53B 10.25B 4.02B 51.1B 4.04B 3.95B 171B
Net income 3.05B 94.53M 82.17M 76.49M 70.22M 133M 9.02B 135M 902M 354M 4.49B 355M 347M 15.06B 4.5B 139M 121M 113M 104M 196M 13.31B 199M 1.33B 522M 6.62B 523M 512M 22.21B
Net Debt 3.44B 106M 92.49M 86.08M 79.04M 149M 10.16B 152M 1.01B 398M 5.06B 400M 391M 16.95B 5.24B 162M 141M 131M 121M 228M 15.5B 231M 1.55B 608M 7.71B 610M 596M 25.87B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Date Price Change Volume
31/07/26 NT$72.60 +10.00% 8,999,473
30/07/26 NT$66.00 -9.47% 43,913,300
29/07/26 NT$72.90 -10.00% 23,399,658
28/07/26 NT$81.00 -9.90% 23,397,197
27/07/26 NT$89.90 -0.99% 34,517,562
Trader
Investor
-
Global
-
Quality
-
ESG MSCI
A
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
3
Last Close Price
72.60TWD
Average target price
118.00TWD
Spread / Average Target
+62.53%

Quarterly revenue - Rate of surprise

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