Chih-Ming Lai
Chief Executive Officer at Jiangyin Changdian Advanced Packaging Co., Ltd.
Profile
Chih-Ming Lai is currently the Chief Executive Officer of Jiangyin Changdian Advanced Packaging Co., Ltd.
He previously served as the Chief Executive Officer & Executive Director of STATS ChipPAC Pte Ltd.
from 2017 to 2018 and as a Non-Executive Non-Independent Director from 2015 to 2017.
He also held the position of Executive Vice President at JCET Group Co., Ltd.
Chih-Ming Lai active positions
| Companies | Position | Start |
|---|---|---|
Jiangyin Changdian Advanced Packaging Co., Ltd.
 Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Part of JCET Group Co., Ltd., Jiangyin Changdian Advanced Packaging Co., Ltd. is a private company that manufactures and develops semiconductor chip and related products. The company is based in Jiangyin, China. The CEO of the Chinese company is Chih-Ming Lai. | Chief Executive Officer | - |
Former positions of Chih-Ming Lai
| Companies | Position | End |
|---|---|---|
| STATS CHIPPAC LTD. | Chief Executive Officer | 26/09/2018 |
| STATS CHIPPAC LTD. | Director/Board Member | 21/02/2017 |
| JCET GROUP CO., LTD. | Corporate Officer/Principal | - |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Listed companies | 1 |
|---|---|
| JCET GROUP CO., LTD. | Electronic Technology |
| Private companies | 2 |
|---|---|
STATS ChipPAC Pte Ltd.
 STATS ChipPAC Pte Ltd. Electronic Equipment/InstrumentsElectronic Technology STATS ChipPAC Pte Ltd. engages in the provision of semiconductor test and packaging services. Its services includes design, characterization, and wafer bumping.The company was founded by June Lihan Chia in 1994 and is headquartered in Singapore. | Electronic Technology |
Jiangyin Changdian Advanced Packaging Co., Ltd.
Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Part of JCET Group Co., Ltd., Jiangyin Changdian Advanced Packaging Co., Ltd. is a private company that manufactures and develops semiconductor chip and related products. The company is based in Jiangyin, China. The CEO of the Chinese company is Chih-Ming Lai. | Electronic Technology |
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