Share class: Amkor Technology, Inc.

VoteQuantityFree-FloatCompany-owned sharesTotal Float
Stock A 1 292,993,060 109,767,125 ( 37.46 %) 46,362,000 ( 15.82 %) 37.46 %

Major shareholders: Amkor Technology, Inc.

NameEquities%Valuation
Kim Family Trusts
45.99 %
113,677,145 45.99 % 4 488 M $
915 Investments LP
16.02 %
39,594,980 16.02 % 1 563 M $
Sujochil LP
7.882 %
19,484,809 7.882 % 769 M $
Kim Capital Partners LLC
6.76 %
16,710,668 6.76 % 660 M $
Vanguard Fiduciary Trust Co.
6.384 %
15,779,847 6.384 % 623 M $
DFA Australia Ltd.
5.154 %
12,740,154 5.154 % 503 M $
BlackRock Advisors LLC
5.017 %
12,401,400 5.017 % 490 M $
2.919 %
7,214,494 2.919 % 285 M $
2.77 %
6,847,739 2.77 % 270 M $
AQR Capital Management LLC
1.704 %
4,211,529 1.704 % 166 M $
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Breakdown by shareholder type

Other81.13%
Institutional38.12%
Individuals7.07%
State Street Corp.1.39%
SEI Investments Co.0.11%
Schweizerische Nationalbank0.1%
Governments0.05%
Manulife Financial Corp.0.04%
Silvercrest Asset Management Group, Inc.0.03%

Based on 1000 largest holdings

Geographical origin of shareholders

United States
112.97%
Individuals
7.07%
Australia
5.16%
United Kingdom
1.35%
Norway
0.4%
Germany
0.28%
Ireland
0.27%
Canada
0.13%
Switzerland
0.12%
Taiwan
0.07%
Hong Kong
0.05%
France
0.04%
Belgium
0.04%
Puerto Rico
0.03%
Sweden
0.03%
Cayman Islands
0.01%
South Korea
0.01%
Singapore
0.01%

Based on 1000 largest holdings

Logo Amkor Technology, Inc.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Employees
28,300
More about the company