Share class: ACM Research, Inc.

VoteQuantityFree-FloatCompany-owned sharesTotal Float
Stock A 1 5,021,811 0 0 77.92 %
Stock B 1 57,606,036 48,800,163 ( 84.71 %) 0

Major shareholders: ACM Research, Inc.

NameEquities%Valuation
BlackRock Advisors LLC
12.55 %
7,512,128 12.55 % 418 M $
Vanguard Fiduciary Trust Co.
8.307 %
4,972,103 8.307 % 277 M $
LSV Asset Management
3.977 %
2,380,521 3.977 % 133 M $
Shanghai Science & Technology Venture Capital Group Co. Ltd.
3.907 %
2,338,510 3.907 % 130 M $
3.271 %
1,958,041 3.271 % 109 M $
Triata Capital Ltd.
3.224 %
1,929,919 3.224 % 107 M $
2.921 %
1,748,548 2.921 % 97 M $
Southeastern Asset Management, Inc.
2.807 %
1,680,181 2.807 % 94 M $
Morgan Stanley Capital Services LLC
2.326 %
1,392,306 2.326 % 78 M $
Geode Capital Management LLC
2.244 %
1,342,899 2.244 % 75 M $
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NameEquities%Valuation
81.91 %
4,166,808 81.91 % 232 M $
5.898 %
300,000 5.898 % 17 M $
2.949 %
150,003 2.949 % 8 M $

Breakdown by shareholder type

Institutional72.13%
Individuals13.36%
Other4.44%
State Street Corp.3.27%
SEI Investments Co.0.19%
Schweizerische Nationalbank0.18%
Manulife Financial Corp.0.04%
Governments0.03%
Unknown6.36%

Based on 1000 largest holdings

Geographical origin of shareholders

United States
62.08%
Individuals
13.36%
Hong Kong
5.28%
United Kingdom
5.11%
China
3.91%
Ireland
1.08%
Austria
0.76%
Canada
0.54%
Australia
0.41%
Cayman Islands
0.39%
France
0.25%
Switzerland
0.22%
Singapore
0.09%
Norway
0.07%
Sweden
0.03%
Spain
0.02%
South Korea
0.01%
Thailand
0.01%
Italy
0.01%
Japan
0.01%

Based on 1000 largest holdings

Logo ACM Research, Inc.
ACM Research, Inc. develops, manufactures, and sells production equipment and provides service solutions for single-wafer or batch wet cleaning, electroplating, stress-free polishing, plasma-enhanced chemical vapor deposition (PECVD), track and thermal processes. The Company offers two principal models of wet wafer cleaning equipment based on its Space Alternated Phase Shift (SAPS) technology, Ultra C SAPS II and Ultra C SAPS V. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional (3D) wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The Company also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers.
Employees
2,513
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