Teradyne, Inc. announced an integrated test cell solution supporting known good device screening for devices used in AI and data center applications, developed in collaboration with Tokyo Electron. The solution pairs Teradyne?s UltraFLEXplus platform with Tokyo Electron?s Prexa SDP (Singulated Device Prober) to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. Teradyne and Tokyo Electron have collaborated to deliver an integrated test cell solution supporting known good device screening for devices used in AI and data center applications.

The solution pairs Teradyne?s UltraFLEXplus platform with Tokyo Electron?s Prexa SDP to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. As AI and data center device architectures increasingly adopt chiplet-based designs that integrate multiple die into a single 2.5D or 3D package, a single defective die can compromise the entire high-value package. Adding known good device screening is essential to protecting final yield, improving quality, and maximizing output.

The joint solution between Teradyne and Tokyo Electron delivers a validated test cell designed to reduce integration risk for high-volume manufacturing. Within the test cell, Teradyne?s UltraFLEXplus instruments coordinate with Tokyo Electron?s PrexaSDP, which maintains device temperature and manages the high-power dissipation characteristics typical of leading-edge AI silicon. Built on an open ecosystem architecture, the solution provides customers with flexibility across complementary probe cards, manipulators, and interface technologies, and can be integrated with other probers or testers as required.

The commercially available solution, developed by Teradyne in collaboration with Tokyo Electron, represents a significant advancement in meeting the rigorous demands of AI and data center device manufacturing. By combining Teradyne's UltraFLEXplus platform with Tokyo Electron's Prexa SDP prober, customers gain access to a robust, production-ready known good device screening solution that helps ensure advanced 2.5D and 3D packages achieve the reliability and performance required for next-generation AI and data center architectures.