Intel Corporation announced the appointment of Cindy Stoddard as senior vice president and chief information officer (CIO), effective December 1, 2025. Stoddard will report directly to CEO Lip-Bu Tan and lead Intel's global IT organization as the company accelerates its digital transformation and modernizes its technology infrastructure. Stoddard brings more than 25 years of experience modernizing digital operations at scale.
She joins Intel from Adobe, where she spent nine years leading global IT and cloud operations. At Adobe, she drove the company's cloud migration and enterprise data strategy, playing a key role in the company's digital transformation initiatives. Prior to Adobe, Stoddard held senior technology leadership roles at NetApp, Safeway, APL (American President Lines), and Consolidated Freightways, where she developed deep expertise in logistics and built high-performing teams known for operational excellence and customer-focused innovation.
In her new role, Stoddard will guide the next phase of Intel's digital transformation, focusing on modernizing systems, strengthening enterprise-wide data integration, and enabling faster and more secure decision-making across the business. She will also advance Intel's internal AI-enabled IT transformation as the company positions itself at the forefront of artificial intelligence innovation. Stoddard?s appointment reflects Intel's continued strategic focus on strengthening its technology capabilities and operational efficiency as the company deepens its transformation under Tan's leadership.
Intel Corporation is the world leading manufacturer of semiconductor. Net sales break down by family of products and services as follows:
- computing architectures products (69.6%): processors and microprocessors (Pentium, Intel Xeon brands, etc.), graphics cards, chips and motherboards, connectivity products, cellular modems, Ethernet controllers, network components, storage products, etc. for PCs, servers, data centers, cloud networks, workstations, notebooks, Internet of Things, graphics architectures, intelligent peripherals and communications infrastructures. The group also develops associated software;
- wafer manufacturing services (25%): accelerators, monolithic chips, silicon wafers, etc. The group also offers chiplet software and mask manufacturing equipment for advanced lithography;
- other (5.4%).
Net sales (including intragroup) are distributed geographically as follows: the United States (24.5%), China (29.2%), Singapore (19.2%), Taiwan (14.7%) and others (12.4%).
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