As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. announced that BOS Semiconductors has licensed its SensPro AI DSP architecture for the Eagle-A standalone ADAS System-on-Chip (SoC). Eagle-A is designed for advanced driver assistance and autonomous driving systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces for camera, LiDAR, and radar fusion.
Ceva's SensPro AI DSP is optimized for LiDAR and radar pre-processing, enabling efficient handling of raw sensor data and reducing latency in perception pipelines. Ceva's chiplet strategy further enhances scalability, with Eagle-A designed to work alongside the Eagle-N AI accelerator in multi-die configurations connected via UCIe and PCIe. This approach enables OEMs to tailor compute performance for diverse ADAS and autonomous driving requirements.
In addition, the modular design of BOS's Eagle series enables flexible deployment across edge AI applications beyond automotive, such as robotics and drones. Ceva's SensPro architecture is optimized for sensor processing, AI inference, and control algorithms, delivering exceptional performance per watt while meeting the stringent power and safety requirements of automotive applications.
