Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced its participation in the following upcoming investor conferences:
UBS Global Technology and AI Conference on Tuesday, December 2, 2025. Amkor’s presentation will occur at 9:35 am Mountain Standard Time (11:35 am Eastern Standard Time) in Scottsdale, Arizona.
Nasdaq 53rd Investor Conference on Tuesday, December 9, 2025. Amkor’s presentation will occur at 4:30 pm Greenwich Mean Time (11:30 am Eastern Standard Time) in London, United Kingdom.
Live webcasts and replays of the presentations will be available on the Investor Relations section of Amkor’s website at ir.amkor.com. Management will also be available for one-on-one and small group meetings with investors.
About Amkor Technology, Inc.
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
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