On October 28, 2025, John Liu, resigned as a member of the Board of Directors of Amkor Technology, Inc. The resignation was not due to any disagreements with the Company on any matter relating to the Company?s operations, policies or practices. In connection with Mr. Liu?s resignation, the Board reduced the size of the Board from eleven to ten directors. Mr. Liu joins the Company as Executive Vice President, Corporate Development and Strategy on November 3, 2025.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
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Investor
Investor
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Global
Global
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Quality
Quality
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