ACM Research, Inc. announced the delivery of its first Ultra Lith Baker ("Ultra Lith BK") system to a leading global display panel manufacturer. The system is engineered to address industry-wide challenges in advanced lithography, including process non-uniformity, thermal drift, and critical dimension ("CD") variation. It can also help semiconductor manufacturers maintain stable yield and pattern fidelity as device geometries continue to shrink.
With ultraviolet ("UV") curing uniformity and precision temperature control, the Ultra Lith BK enables highly stable and repeatable lithography processes. The Ultra Lith BK's UV curing system delivers +-5% UV intensity uniformity, ensuring consistent resist hardening across the wafer. The system supports line-scan, rotary, and hybrid UV-curing exposure modes to maximize process flexibility.
Its advanced thermal management architecture further reduces CD variation, overlay error, and pattern distortion--all critical to yield improvement and long-term process reliability. The Ultra Lith BK integrates six cold plates delivering temperature uniformity of +-0.1degC. The system adopts a configurable design and can accommodate up to 32 hotplates and two UV curing systems, enabling customers to flexibly configure the tool according to different process recipes and photoresist integration requirements.
Two types of hotplates are available: The high-flow hotplate achieves a maximum process temperature of 250degC with temperature uniformity 0.2%. The low-flow hotplate operates at temperatures up to 180degC with temperature uniformity 0.08%, offering benchmark-level performance in the industry.
