3M Company had joined a group of technology companies to establish a new multi-source agreement focused on advancing open, interoperable specifications for expanded beam optical connectivity in AI infrastructure. Expanded beam optical technology is increasingly seen as a critical enabler for AI infrastructure, offering advantages in reliability, ease of maintenance, and performance in high-density environments. As hyperscale and enterprise AI deployments grow, standardized approaches to optical connectivity are expected to play a key role in reducing complexity and accelerating time to deployment.

The MSA brings together industry leaders including 3M, Accelink, Aperion, AMD, Amphenol, Arista Networks, Cisco, Meta, Molex, Nexthop-ai, Oracle, Senko, Source Photonics, Sumitomo, TE Connectivity, viaPhoton, and Xscape Photonics to collaboratively develop standardized specifications for a range of EBO connector solutions. The effort is designed to accelerate deployment of high-performance optical interconnects required to support the rapid scaling of AI data centers. The MSA will provide a collaborative framework for members to contribute to a shared specification covering multiple EBO connector configurations.

The MSA is open to additional members across the data center and networking ecosystem. The initial technical working group has begun development of the first connector specification.